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Tuesday, Mar 21
8:50 AM – 9:10 AM ET

T07.2 - 10 kV SiC MOSFET Power Module with Double-Sided Jet-Impingement Cooling
Location: W105
Technical Lecture Presenter: Mark Cairnie – Virginia Tech
Power Modules / High Density Design
Tuesday, Mar 21
9:10 AM – 9:30 AM ET

T07.3 - A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-Layer for Partial Discharge Reduction
Location: W105
Technical Lecture Presenter: Xiaoling Li, MA – Univerity of Arkansas
Power Modules / High Density Design
Tuesday, Mar 21
9:30 AM – 9:50 AM ET

T07.4 - Design Considerations of a 3.3 kV SiC-Based Reverse Voltage Blocking Module for Current Source Inverter Application
Location: W105
Technical Lecture Presenter: Sneha Narasimhan – NCSU
Power Modules / High Density Design
Tuesday, Mar 21
9:50 AM – 10:10 AM ET

T07.5 - Common Source Inductance Compensation Technique for Dynamic Current Balancing in SiC MOSFETs Parallel Operations
Location: W105
Technical Lecture Presenter: Boyi Zhang – Delta Electronics (Americas) Ltd.
Power Modules / High Density Design
Tuesday, Mar 21
10:40 AM – 11:00 AM ET

T07.6 - Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
Location: W105
Technical Lecture Presenter: Hao Chen – University of Arkansas
Power Modules / High Density Design
Tuesday, Mar 21
11:00 AM – 11:20 AM ET

T07.7 - A Novel Integrated 1.2 kV Double-Sided Cooled Power Module
Location: W105
Technical Lecture Presenter: Riya Paul – University of Arkansas
Power Modules / High Density Design
Tuesday, Mar 21
11:40 AM – 12:00 PM ET

T07.9 - A Smart Silicon Carbide Power Module with Pulse Width Modulation Over Wi-Fi and Wireless Power Transfer-Enabled Gate Driver
Location: W105
Technical Lecture Presenter: Faisal Khan – National Renewable Energy Laboratory
Power Modules / High Density Design
Thursday, Mar 23
9:50 AM – 10:10 AM ET

T30.5 - Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module with Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating
Location: W108
Technical Lecture Presenter: Zichen Zhang – Virginia Tech
Power Modules / High Density Design
Thursday, Mar 23
10:40 AM – 11:00 AM ET

T30.6 - A 2x2 Paralleling GaN Half-Bridge Power Module for High-Density 500kHz 3.3kW CLLC Converter
Location: W108
Technical Lecture Presenter: Satoshi Otsu – Panasonic Industry Co Ltd
Power Modules / High Density Design
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.1 - A Gallium Nitride Intelligent Power Module Based on Bonding Wire Interconnection
Location: HALL WA3
Technical Dialogue Presenter: Yilong Yao – State Key Laboratory of Electrical Insulation and Power Equipment
Power Modules / High Density Design
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.3 - A Double-Sided Cooling 6.5kV SiC MOSFET Power Module with Insulation Enhancement Design
Location: HALL WA3
Technical Dialogue Presenter: Liangjun Ma – School of Electrical Engineering Xi’an Jiaotong University
Power Modules / High Density Design
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.12 - Advanced GaN IPM for High-Frequency Converter Applications Enabled with Thin-Substrates
Location: HALL WA3
Technical Dialogue Presenter: Sourish S Sinha – FREEDM Systems Center North Carolina State University
Power Modules / High Density Design
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.13 - Packaging and Characterization of an Ultra Compact 1200V PCB SiC MOSFET Half-Bridge Module
Location: HALL WA3
Technical Dialogue Presenter: Wei-Jung Hsu – University of Texas at Austin
Power Modules / High Density Design
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.14 - Hybrid Power Module: Silicon and SiC Combination – Technical Win or Pain
Location: HALL WA3
Technical Dialogue Presenter: Ondrej Picha – onsemi
Power Modules / High Density Design
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.16 - Decoupling Device for Small Commutation Loop and Improved Switching Performance with Large Power Transistors
Location: HALL WA3
Technical Dialogue Presenter: Logan Horowitz – UC Berkeley
Power Modules / High Density Design
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.19 - 3.3 kV Low-Inductance Full SiC Power Module
Location: HALL WA3
Technical Dialogue Presenter: Yuxiang Chen – Univerity of Arkansas
Power Modules / High Density Design
Thursday, Mar 23
2:25 PM – 2:45 PM ET

T34.3 - Review of Radiated EMI Modeling and Mitigation Techniques in Power Electronics Systems
Location: W101
Technical Lecture Presenter: Zhedong Ma, PhD candidate – University of Florida
Power Modules / High Density Design