Type here to filter the list

Thursday, Mar 23
8:30 AM – 8:55 AM ET

IS20.1 - Assessment of MOSFET Switching Losses Based on Junction Temperature: Comparison in an LLC Converter Between TO-247 and ACEPACK™ SMIT Using MDmesh™ DM6 Technology
Location: W203ABC
Industry Session Presenter: Alfio Scuto – STMicroelectronics
Packaging and Thermal Management
Thursday, Mar 23
8:55 AM – 9:20 AM ET

IS20.2 - Maximize Performances and Power Density in AC-DC Power Conversion by Using SMD Packages with Top-Side Cooling
Location: W203ABC
Industry Session Presenter: Ludovica Longo – STMicroelectronics
Packaging and Thermal Management
Thursday, Mar 23
9:20 AM – 9:45 AM ET

IS20.3 - Robust, Flexible Copper Interconnections to Enhance Performance and Reliability of SiC Power Modules for Traction Inverters
Location: W203ABC
Industry Session Presenter: Brandon Passmore – Wolfspeed
Packaging and Thermal Management
Thursday, Mar 23
9:45 AM – 10:10 AM ET

IS20.4 - Thermal Management for Bottom-Side Cooled Surface-Mount SiC Devices
Location: W203ABC
Industry Session Presenter: Tamanna Bhatia, MS – Wolfspeed
Packaging and Thermal Management
Thursday, Mar 23
10:30 AM – 10:55 AM ET

IS20.5 - Inverter/Converter Power Density and Flexibility Improvements Through Modularity and Novel Thermal Management Architecture
Location: W203ABC
Industry Session Presenter: Ian Byers – Marel Power Solutions
Packaging and Thermal Management
Thursday, Mar 23
10:55 AM – 11:20 AM ET

IS20.6 - GaN Transistor for Next Generation Power Supply Units
Location: W203ABC
Industry Session Presenter: Bo Sheng – GaN Systems Inc.
Packaging and Thermal Management