This presentation will explain the technical challenges that come with miniaturization of inverter and converter technology and how Marel is addressing these challenges through modularity, specialized manufacturing techniques and a unique thermal management architecture. We will build upon silicon and silicon carbide die choice and placements on substrate and continue by explaining the Marel thermal pathways and innovations surrounding the cooling system. We will also tie in our building block approach and show how the same blocks can be applied to liquid and air cooled system designs.
