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Tuesday, Mar 21
9:10 AM – 9:30 AM ET

T02.3 - Frequency Response Characterization of High-Bandwidth Current Viewing Resistors Used in Dynamic Testing of Power Semiconductors
Location: W101
Technical Lecture Presenter: Sergio Jimenez – The University of Alabama
Device and Component Modeling
Tuesday, Mar 21
10:40 AM – 11:00 AM ET

T02.6 - Analytical Modelling of SiC MOSFET Based on Datasheet Parameters Considering the Dynamic Transfer Characteristics and Channel Resistance Dependency on the Drain Voltage
Location: W101
Technical Lecture Presenter: Hemanth Betha – University of Sheffield
Device and Component Modeling
Tuesday, Mar 21
11:40 AM – 12:00 PM ET

T02.9 - An Empirical Capacity Estimation Model for Lithium-Ion Battery Cells Using Surface Temperature and Terminal Voltage Measurements
Location: W101
Technical Lecture Presenter: Ala Hussein – University of Central Florida
Device and Component Modeling
Wednesday, Mar 22
4:30 PM – 4:50 PM ET

T24.9 - Demagnetization Modeling and Analysis for MTPA-Driven Permanent Magnet Motors with Distributed Lap Windings
Location: W108
Technical Lecture Presenter: Jinqiu Gao – Central South University
Device and Component Modeling
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D08.1 - Analysis of Switching Voltage Regulator Noise Coupling to Signal via Using a Novel Simulation Approach
Location: HALL WA3
Technical Dialogue Presenter: Soumya Singh – DELL Technologies
Device and Component Modeling
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D08.3 - Performance Comparison of Miniaturized Isolation Transformer Topologies
Location: HALL WA3
Technical Dialogue Presenter: Yue Wu – Dartmouth
Device and Component Modeling
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D08.5 - Heat Cycle Failure Point Prediction by 3D Thermal Stress Analysis for Medium Voltage Power Module
Location: HALL WA3
Technical Dialogue Presenter: Masaki Takahashi – Aalborg university
Device and Component Modeling
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D08.7 - An Implementation of Dowell Model with Neural Network to Foil Winding Transformer
Location: HALL WA3
Technical Dialogue Presenter: Yu Hsin Wu – Nagoya University
Device and Component Modeling