Florida International University
Dr. Markondeya Raj Pulugurtha's expertise is in package integration, power and RF modules, passive component integration with nanoscale materials and structures, high-density hermetic packaging, device and board-level interconnections and characterization.
He coauthored ~360 publications which include 8 patents, 20 book chapters, magazine articles, >95 journal papers ~180 IEEE conference articles.
He was the IEEE Nanotechnology Distinguished Lecturer (2020-2022), IEEE T-CPMT Best Associate Editor (2021), received ~30 best-paper awards including the “Distinguished Scholar Award” from the Microbeam Analysis Society, IEEE Transactions of Advanced Packaging Commendable paper Award, IEEE Outstanding Technical Paper, multiple IEEE ECTC Best-Poster Awards, Philips Best Paper Award, and others. His research with students was also selected for "Intel Best Student Paper Award", "Motorola Electronic Packaging Student Paper award" and several others.
He was the Chair of the “High-Speed Wireless Components” thrust in the CPMT, Electronics and Component Technology Conference and also acts as the Co-Chair for the IEEE Nanopackaging Technical Committee. He is the CPMT representative for the Nanotechnology Research Council, Associate Editor for IEEE Transactions on Components, Packaging and Manufacturing Technologies and Associate Editor for IEEE Nanotechnology Magazine. He is the General Chair for the 3D PEIM 2023 Power Electronics Conference.
He was a plenary speaker (APEC 2018, IMAPS EPEPS 2021), keynote speaker (several conferences), panelist (APEC 2022), short-course instructor (IMAPS and ECTC), and invited speaker at several industry executive and advisory board meetings in multipe companies.
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Wednesday, March 22, 2023
11:30 AM – 11:55 AM ET