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Latest 3D-Packaging Technology for Power Electronics

Latest 3D-Packaging Technology for Power Electronics

IS10.7 - Scalable magnetic thin film multilayering technology for power inductor integration in laminates

Wednesday, March 22, 2023

11:30 AM – 11:55 AM ET

Location: W205BC

Industry Session Presenter(s)

Pulugurtha Raj

Florida International University

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