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Tuesday, Mar 21
11:20 AM – 11:40 AM ET

T02.8 - Novel Gerber File-Based Numerical Modeling and Simulation for Thermal Analysis of Printed Circuit Boards
Location: W101
Technical Lecture Presenter: Paul Ziegenfelder – Utah State University
Software Tools
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D08.8 - Development of Simulation Prediction Techniques for Low Frequency Emissions
Location: HALL WA3
Technical Dialogue Presenter: Yanwen Lai – University of Florida
Software Tools