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Tuesday, Mar 21
8:30 AM – 8:50 AM ET

T07.1 - Design, Fabrication and Testing of 3.3 kV/200A SiC Half-Bridge Power Module
Location: W105
Technical Lecture Presenter: Yang Li – Stony Brook University
Power Electronics Packaging
Wednesday, Mar 22
1:50 PM – 2:10 PM ET

T21.2 - Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors
Location: W104
Technical Lecture Presenter: Zhongchao Sun – Aalborg University
Power Electronics Packaging
Wednesday, Mar 22
2:50 PM – 3:10 PM ET

T21.5 - Thermal Stress Reliability Comparison of WB and POL-kW Structure by Power Cycling and Simulation
Location: W104
Technical Lecture Presenter: Youichi Nishihara – Shinko Electric Industries Co.,Ltd.
Power Electronics Packaging
Wednesday, Mar 22
3:50 PM – 4:10 PM ET

T21.7 - Study on Thermal Stress Behavior of Mold Type POL Tile
Location: W104
Technical Lecture Presenter: Kei Murayama – Shinko Electric Industries Co. Ltd.
Power Electronics Packaging
Thursday, Mar 23
8:30 AM – 8:50 AM ET

T30.1 - Layout-Dominated Electro-Thermal Optimization for Multichip Power Modules with Response Surface and Fourier Series Model
Location: W108
Technical Lecture Presenter: Yu Chen – Zhejiang University
Power Electronics Packaging
Thursday, Mar 23
8:50 AM – 9:10 AM ET

T30.2 - Experimental Evaluation of Liquid Immersed Electronics for High Density Power Converters
Location: W108
Technical Lecture Presenter: Jamie Turnbull – UW-Madison
Power Electronics Packaging
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.7 - Highly Reliable Silver Sintering Joints for Power Module Application
Location: HALL WA3
Technical Dialogue Presenter: Sihai Chen – Indium Corporation
Power Electronics Packaging
Thursday, Mar 23
11:30 AM – 1:30 PM ET

D07.10 - High-Temperature (250°C) SiC Power Module Integrated with LTCC-Based Isolated Gate Driver
Location: HALL WA3
Technical Dialogue Presenter: Salahaldein Ahmed – UA
Power Electronics Packaging