Speaker: Eelco Bergman – ASE
Panel Session Moderator: Mark da Silva, PhD – SEMI
@@@ John Behnke – Inficon ### 1718164###Panelist###General Manager FPS Product Line###Inficon###Panelist: John Behnke – Inficon
@@@ Bill Pierson – KX ### 1718163###Panelist###Vice President, Semiconductor and Manufacturing###KX###Panelist: Bill Pierson – KX
@@@ Ian Bone – Broadcom ### 1668292###Panelist###Industrial Engineering Manager###Broadcom###Panelist: Ian Bone – Broadcom
@@@ Justin Weinstein – GlobalFoundries ### 1670188###Panelist###Principal Engineer###GlobalFoundries###Panelist: Justin Weinstein – GlobalFoundries
@@@ David M. Fried, PhD – Lam Research ### 1653397###Panelist###Vice President ,Computational Products###Lam Research###Panelist: David M. Fried, PhD – Lam Research
Panel Session Moderator: Jeorge S. Hurtarte, PhD, MBA – Lam Research
@@@ David M. Fried, PhD – Lam Research ### 1653397###Panelist###Vice President ,Computational Products###Lam Research###Panelist: David M. Fried, PhD – Lam Research
@@@ Gaurav Verma, MS, BTech – Qualcomm ### 1718866###Panelist###Senior Director of Engineering###Qualcomm###Panelist: Gaurav Verma, MS, BTech – Qualcomm
@@@ Adam Smith – LitePoint ### 1721480###Panelist###Director of Marketing###LitePoint###Panelist: Adam Smith – LitePoint
@@@ Eli Roth – Teradyne ### 1721481###Panelist###Smart Manufacturing Product Manager###Teradyne###Panelist: Eli Roth – Teradyne
@@@ Ravi Mahajan, PhD – Intel ### 1675218###Panelist###Intel Fellow, Director of Pathfinding for Assembly and Packaging Technologies for 7nm Silicon and Beyond , Technology and Manufacturing Group###Intel###Panelist: Ravi Mahajan, PhD – Intel
@@@ Mark Gerber – ASE ### 1724573###Panelist###Sr. Director of Engineering and Technical Marketing###ASE###Panelist: Mark Gerber – ASE
Session Moderator: Margaret Kindling, BS – SEMI Foundation
@@@ Ann Marie Amaro – EA Machining ### 1678454###Panelist###President###EA Machining###Panelist: Ann Marie Amaro – EA Machining
@@@ Ying Liu – Blue Lake Packaging ### 1691700###Panelist###Founder & CEO###Blue Lake Packaging###Panelist: Ying Liu – Blue Lake Packaging
@@@ Garima Gautam – Intel ### 1695636###Panelist###Engineering Manager###Intel###Panelist: Garima Gautam – Intel
@@@ Somer D. Mead – GlobalFoundries ### 1678456###Panelist###Director in Global Supply Management - Business Operations###GlobalFoundries###Panelist: Somer D. Mead – GlobalFoundries
@@@ Darcy Hall – Micron ### 1691095###Panelist###Global Manager, Supplier Diversity###Micron###Panelist: Darcy Hall – Micron
Speaker: Aviram Tam, MSc – Applied Materials
Speaker: Chris Progler, PhD – Photronics
Speaker: Kathryn Garner – TEL
@@@ Hannah Rosen, CMSE – TEL ### 1679296###Speaker###EHS Equipment Integration Engineer###TEL###Speaker: Hannah Rosen, CMSE – TEL
Speaker: Ram Prasad Gandhiraman, PhD – Space Foundry
Speaker: Sheng Xu, PhD – University of California, San Diego
Poster Presenter: Mieko Hirabayashi, PhD – Sandia
Poster Presenter: Tom Tran – Teradyne
Poster Presenter: Lauren Getz – Teradyne
Poster Presenter: David Ducrocq – Teradyne
Poster Presenter: Don Thompson, MA – R&D Altanova
Session Moderator: Stacy D. Ajouri, MSEE – Texas Instruments
Speaker: Abeer Singhal – Future Foundation North America
Speaker: Lori Diachin, PhD – Exascale Computing Project (ECP)
Speaker: Ian Bone – Broadcom
Speaker: Michael Durstock, PhD – Air Force Research Laboratory
Speaker: Daniel R. Hines – Laboratory for Physical Sciences
Session Chair: Robert F. Praino, Jr., MS, MBA – CHASM Advanced Materials
Speaker: David Keicher – Integrated Deposition Solutions
Moderator: Richard L. Dumene – Texas Instruments
@@@ Alan Liao – FormFactor ### 1688781###Moderator###Director, Probe BU Product Marketing###FormFactor###Moderator: Alan Liao – FormFactor
Speaker: Dean Turnbaugh – NTVUSA/NSM