Sr. Director of Engineering and Technical Marketing
ASE
Mark is Sr. Director of Engineering and Marketing at ASE (US) Inc., He provides technical support for customer activities around the world focused on 5G and Automotive segments with package platform focus areas including Flip Chip, Copper Pillar, Advanced RDL and SiP Packaging Technologies. Mark has 28 years of semiconductor packaging experience working for Advanced Semiconductor Engineering-ASE, Texas Instruments, Motorola and Maxim Integrated in various areas of design, manufacturing and assembly with an emphasis on the development of new technologies and processes. Mark has served as general chair for multiple conferences and led multiple committees for IMAPS and IEEE. Mark was awarded the IMAPS Fellow title in 2018. He holds a bachelor’s degree in Mechanical Engineering from Texas A&M University, has written +20 papers and holds over 32 semiconductor packaging patents.
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Thursday, July 14, 2022
9:00am – 4:30pm
Thursday, July 14, 2022
3:00pm – 4:00pm