IS20 - Packaging and Thermal Management

Industry Session Chair(s)

• 

  Douglas Hopkins, PhD

  Professor
  PREES Lab at NC State University
  North Carolina State University
  NC State University, United States
• 

  Ratul Das

  University of California San Diego, United States

Presentations:

• 8:30 AM – 8:55 AM ET

  Assessment of MOSFET Switching Losses Based on Junction Temperature: Comparison in an LLC Converter Between TO-247 and ACEPACK™ SMIT Using MDmesh™ DM6 Technology
  

  Industry Session Presenter: Alfio Scuto – STMicroelectronics
• 8:55 AM – 9:20 AM ET

  Maximize Performances and Power Density in AC-DC Power Conversion by Using SMD Packages with Top-Side Cooling
  

  Industry Session Presenter: Ludovica Longo – STMicroelectronics
• 9:20 AM – 9:45 AM ET

  Robust, Flexible Copper Interconnections to Enhance Performance and Reliability of SiC Power Modules for Traction Inverters
  

  Industry Session Presenter: Brandon Passmore – Wolfspeed
• 9:45 AM – 10:10 AM ET

  Thermal Management for Bottom-Side Cooled Surface-Mount SiC Devices
  

  Industry Session Presenter: Tamanna Bhatia, MS – Wolfspeed
• 10:30 AM – 10:55 AM ET

  Inverter/Converter Power Density and Flexibility Improvements Through Modularity and Novel Thermal Management Architecture
  

  Industry Session Presenter: Ian Byers – Marel Power Solutions
• 10:55 AM – 11:20 AM ET

  GaN Transistor for Next Generation Power Supply Units
  

  Industry Session Presenter: Bo Sheng – GaN Systems Inc.