Engineer
Shinko Electric Industries Co. Ltd., Japan
Kei Murayama received his B.E. and M.E. degrees in chemical engineering from Shinshu University, Nagano, Japan in 1991 and 1993, respectively.
He joined SHINKO ELECTRIC INDUSTRIES CO., LTD. in 1993.
He has been engaged in the research and development of semiconductor packaging. He has 29 years of experience in semiconductor packaging industry and has worked in various interconnect techniques and packaging techniques such as flip chip bonding, TLP bonding　and silicon interposer.
His current research interests include sintering bonding for high power module and a low temperature and a low stress bonding for high performance package such as organic interposer. He authored and co-authored more than 30 conference papers and 100 patents and patent applications.
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Wednesday, March 22, 2023
3:50 PM – 4:10 PM ET