Virginia Tech, United States
Introduction
Planar magnetics design is a popular choice in the power electronics industry due to its low profile, ease of manufacturing, and high-power density. However, the thermal performance of PCB windings is limited because FR4, the material used for PCBs, has low thermal conductivity, particularly for inner layers. Additionally, to achieve high-density integration, electronic components such as devices and drivers can be embedded in planar magnetics. This concept is illustrated in Figure 1, and this electronic-embedded transformer (EET) can achieve natural current sharing. More information about this concept can be found in [5]. In this paper, we propose a high-efficiency air cooling method for PCB windings and electronic components using the EET system as an example.
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Tuesday, March 21, 2023
11:40 AM – 12:00 PM ET