IS20.1 - Assessment of MOSFET Switching Losses Based on Junction Temperature: Comparison in an LLC Converter Between TO-247 and ACEPACK™ SMIT Using MDmesh™ DM6 Technology

The dissipated power from switching can weigh heavily on the total dissipated power of the device and the consequent reduction in efficiency. In LLC converter this type of dissipated power cannot be measured with standard methods such as using an oscilloscope as some of the energy is recovered and not dissipated. We used a calorimetric method and accurate measurements of both thermal resistance and the temperature of the die. ACEPACK SMIT package was used to obtain a more accurate temperature measurement; it incorporates a complete half-bridge and an NTC thermistor. Same method applied for same die in a TO-247 package.