D07 - Power Converter Design, Packaging, & Integration

Technical Dialogue Session Chair(s)

• AS

  Adam Skorek

  University of Québec at Trois-Rivières
• 

  Zhehui Guo

  Center for Advanced Power Systems Florida State University, United States

Presentations:

• 11:30 AM – 1:30 PM ET

  A Gallium Nitride Intelligent Power Module Based on Bonding Wire Interconnection
  

  Technical Dialogue Presenter: Yilong Yao – State Key Laboratory of Electrical Insulation and Power Equipment
• 11:30 AM – 1:30 PM ET

  A Compact Hybrid Sensor for Chip-Level Online Current Sensing in Press-Pack Power Module
  

  Technical Dialogue Presenter: Weili Guo – Xi'an Jiaotong University
• 11:30 AM – 1:30 PM ET

  A Double-Sided Cooling 6.5kV SiC MOSFET Power Module with Insulation Enhancement Design
  

  Technical Dialogue Presenter: Liangjun Ma – School of Electrical Engineering Xi’an Jiaotong University
• 11:30 AM – 1:30 PM ET

  Analysis of a Transistor-Based On-State Voltage Measurement Circuit for Condition Monitoring of Power Transistors
  

  Technical Dialogue Presenter: Kevin Muñoz Barón – University of Stuttgart
• 11:30 AM – 1:30 PM ET

  Reliability Monitoring and Predictive Maintenance of Power Electronics with Physics and Data Driven Approach Based on Machine Learning
  

  Technical Dialogue Presenter: Yujia Cui – ROCKWELL AUTOMATION INC
• 11:30 AM – 1:30 PM ET

  Transient Thermal Modeling of Power Semiconductors for Long-Term Load Profiles
  

  Technical Dialogue Presenter: Xinyue Zhang – Northwestern Polytechnical University
• 11:30 AM – 1:30 PM ET

  Highly Reliable Silver Sintering Joints for Power Module Application
  

  Technical Dialogue Presenter: Sihai Chen – Indium Corporation
• 11:30 AM – 1:30 PM ET

  A Capacitive Impedance Control Method for Active Capacitor with Adaptive Parameter Capability
  

  Technical Dialogue Presenter: Zhihao Lin – Aalborg University
• 11:30 AM – 1:30 PM ET

  High-Temperature (250°C) SiC Power Module Integrated with LTCC-Based Isolated Gate Driver
  

  Technical Dialogue Presenter: Salahaldein Ahmed – UA
• 11:30 AM – 1:30 PM ET

  Advanced GaN IPM for High-Frequency Converter Applications Enabled with Thin-Substrates
  

  Technical Dialogue Presenter: Sourish S Sinha – FREEDM Systems Center North Carolina State University
• 11:30 AM – 1:30 PM ET

  Packaging and Characterization of an Ultra Compact 1200V PCB SiC MOSFET Half-Bridge Module
  

  Technical Dialogue Presenter: Wei-Jung Hsu – University of Texas at Austin
• 11:30 AM – 1:30 PM ET

  Hybrid Power Module: Silicon and SiC Combination – Technical Win or Pain
  

  Technical Dialogue Presenter: Ondrej Picha – onsemi
• 11:30 AM – 1:30 PM ET

  Alternating Sequence and Zero Vector Modulation with Reduced Switching Losses and Common-Mode Voltage in Current Source Inverters
  

  Technical Dialogue Presenter: Sangwhee Lee – University of Wisconsin-Madison
• 11:30 AM – 1:30 PM ET

  Decoupling Device for Small Commutation Loop and Improved Switching Performance with Large Power Transistors
  

  Technical Dialogue Presenter: Logan Horowitz – UC Berkeley
• 11:30 AM – 1:30 PM ET

  A Mechanically Ultra-Thin Flying Capacitor Multilevel Converter with Embedded Passive Components
  

  Technical Dialogue Presenter: Nicole Stokowski – University of California Berkeley
• 11:30 AM – 1:30 PM ET

  Thermal Mapping of Power Modules Using Optical Fibers During AC Power Cycling Tests
  

  Technical Dialogue Presenter: Francesco Iannuzzo – Aalborg University

  Technical Dialogue Presenter: Kaichen Zhang, MA – Aalborg University
• 11:30 AM – 1:30 PM ET

  3.3 kV Low-Inductance Full SiC Power Module
  

  Technical Dialogue Presenter: Yuxiang Chen – Univerity of Arkansas