T30 - Practical Design Considerations for Power Modules

Technical Lecture Session Chair(s)

• RM

  Ran Mo

  Shell
• SB

  Satarupa Bal

  Eaton

Presentations:

• 8:30 AM – 8:50 AM ET

  Layout-Dominated Electro-Thermal Optimization for Multichip Power Modules with Response Surface and Fourier Series Model
  

  Technical Lecture Presenter: Yu Chen – Zhejiang University
• 8:50 AM – 9:10 AM ET

  Experimental Evaluation of Liquid Immersed Electronics for High Density Power Converters
  

  Technical Lecture Presenter: Jamie Turnbull – UW-Madison
• 9:10 AM – 9:30 AM ET

  Modular Scalable Power Electronics Building Block Based MVDC Solid State Circuit Breakers
  

  Technical Lecture Presenter: Shuyan Zhao – Drexel University
• 9:30 AM – 9:50 AM ET

  Proactive Thyristor-Based DC Solid-State Circuit Breaker
  

  Technical Lecture Presenter: Reza Kheirollahi – Drexel University
• 9:50 AM – 10:10 AM ET

  Package Design of a Double-Side Cooled 20-kV Gallium Nitride Diode Module with Improved Insulation by Nonlinear Resistive Polymer-Nanoparticle Coating
  

  Technical Lecture Presenter: Zichen Zhang – Virginia Tech
• 10:40 AM – 11:00 AM ET

  A 2x2 Paralleling GaN Half-Bridge Power Module for High-Density 500kHz 3.3kW CLLC Converter
  

  Technical Lecture Presenter: Satoshi Otsu – Panasonic Industry Co Ltd
• 11:00 AM – 11:20 AM ET

  A Simple and Non-Destructive Method to Measure Per-Terminal Baseplate Coupling of Power Modules
  

  Technical Lecture Presenter: Brian Deboi – Wolfspeed