Package parasitic limits the usage of through-hole (TH) packages in high frequency designs. This lead to the development of surface mounted device (SMD) packages. With the increasing demand of even higher power in SMPS and other applications, thermal performance of SMD packages is pushing the designs to their limits. To break free from these limitations, the top side cooled (TSC) concept from Infineon Technologies is the next step in the evolution of SMD packages. TSC packages offer all the benefits of SMD while enabling cost efficient high power density designs, system volume reduction, readiness for liquid cooling and longer system lifetime.
