Demanding power applications such as EVs, datacenter/servers, telecoms and circuit protection that use 750V power FETs were able to leverage the continually improved RDS(on) performance for minimizing conduction losses in their end system but were limited to having only through-hole package options. At APEC, Qorvo will present a new 750V SiC FET solution that delivers both unprecedented low RDS(on) and the compactness of a small surface mount package.
