The pursuit of high-power density has never stopped on the road of power electronics. Planar magnetics has a superior advantage in power density potential thanks to its low profile. However, thermal is the bottleneck for further improving the power density of the planar inductor and matrix transformer. Furthermore, 40% of the world\'s power consumption is in electrical energy, power distribution and electronics consists large percentage [1]. A high-efficiency power converter must have a highly efficient cooling system to achieve overall high efficiency. A high-power density circuit may trade off its individual power density to achieve an overall high-power density with the cooling system. This paper proposes a high-efficiency modular air-cooling method for PCB winding with fluid dynamic and thermal dynamic improvement.
