We show that the sintering paste can be used in different material configurations aiming at different application fields including die attach (semiconductor/AMB) and semiconductor/leadframe), clip attach (semiconductor/clip) and substrate to heatsink (AMB (DBC)/Cu (Al)). It shows that the shear strength of the joints is around 50MPa after the formation of the joints, this keeps strong even 3000 cycles of TST, failure mode and cross-section analysis also confirm the reliability of the joints.
