3D thermal stress simulation was used to predict the heat cycle test failure point of the medium voltage power module. The module has multi-layer of two different ceramics as isolation layers. In this structured module, the high stress point indicated by the 3D thermal stress simulation proved to be the failure point of the actual sample. 3D simulation was used to analyze the thermo-mechanical fragility of the power modules. The initial failure point was copper delamination from the AlN, and it was matched with the high peeling stresses and shape deformation point of simulation results.
