D08.6 - A Virtual Prototyping System for Silicon-Carbide Power Modules
Thursday, March 23, 2023
11:30 AM – 1:30 PM ET
Location: HALL WA3
Authors: Klaus Neumaier, Vaclav Valenta, Jonathan Chu, Yunpeng Xiao, Stan Benczkowski, Bob Marquis, Sameer Yadav, Jonathan Harper, Ondrej Picha, Rajani Thirukoluri, Roveendra Paul, Leon Zhang, Levan Bidzishvili, Thierry Bordignon, James Victory
This paper describes a holistic design and simulation tool deployed for virtual prototyping of SiC power modules. The power module designer proceeds from concept to virtual prototype in a logical, comprehensive flow. Starting with a simple 2D DXF of the Direct Bond Copper (DBC), the module is designed through die selection and placement, layer and material property declaration, electrical connectivity, and external port definition. Automated 3D model generation is carried out through advanced Ansys scripting techniques. Finally, multiple levels of simulation and model generation are executed through Ansys Icepak and Q3D, SPICE, and system level PLECS. The tool enables first time right, reliable SiC power modules.