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Latest 3D-Packaging Technology for Power Electronics

Latest 3D-Packaging Technology for Power Electronics

IS10.2 - Sintering Innovations for Power Electronics Packaging & Assembly

Wednesday, March 22, 2023

8:55 AM – 9:20 AM ET

Location: W205BC

Industry Session Presenter(s)

Gyan Dutt

MacDermid Alpha Electronics Solutions, United States

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