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Latest 3D-Packaging Technology for Power Electronics

Latest 3D-Packaging Technology for Power Electronics

IS10.3 - Voice of the Customer presentation on Form Factor by IBM

Wednesday, March 22, 2023

9:20 AM – 9:45 AM ET

Location: W205BC

Industry Session Presenter(s)

Eric Swenson, MSEE

Power Development Engineer
IBM, United States

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