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Latest 3D-Packaging Technology for Power Electronics
Latest 3D-Packaging Technology for Power Electronics
IS10.1 - Manufacturing Challenges and Qualification of 3D Packaging
Wednesday, March 22, 2023
8:30 AM – 8:55 AM
ET
Location: W205BC
Industry Session Presenter(s)
Charles Woychik
Skywater Technology Foundry
PDF
