T21 - Reliability & Thermal Performance of Power Modules

Technical Lecture Session Chair(s)

• CX

  Chunmeng Xu

  ABB
• 

  Jim Marinos

  Payton Planar
  Pratt Institute, United States

Presentations:

• 1:30 PM – 1:50 PM ET

  Power Module Thermal Characterization Considering Aging Towards Online State-of-Health Monitoring
  

  Technical Lecture Presenter: Animesh Kundu Anik – University of Windsor
• 1:50 PM – 2:10 PM ET

  Thermal Characteristics of Liquid Metal Interconnects for Power Semiconductors
  

  Technical Lecture Presenter: Zhongchao Sun – Aalborg University
• 2:10 PM – 2:30 PM ET

  Electrothermal Modeling Based Digital Twin Method for Degradation Parameters Identification of DC-DC Converter
  

  Technical Lecture Presenter: Chuangchuang Lu – Nanjing University of Aeronautics and Astronautics
• 2:30 PM – 2:50 PM ET

  Sliding Window-Based Thermal Topography Determining Thermal Impedance and Thermal Coupling
  

  Technical Lecture Presenter: Shamar Christian – University of Arkansas
• 2:50 PM – 3:10 PM ET

  Thermal Stress Reliability Comparison of WB and POL-kW Structure by Power Cycling and Simulation
  

  Technical Lecture Presenter: Youichi Nishihara – Shinko Electric Industries Co.,Ltd.
• 3:30 PM – 3:50 PM ET

  A Comprehensive Comparison of EFT, RF, and Lightning Susceptibility Tests in DO-160G and MIL-STD-461G
  

  Technical Lecture Presenter: Han Wu – University of Florida
• 3:50 PM – 4:10 PM ET

  Study on Thermal Stress Behavior of Mold Type POL Tile
  

  Technical Lecture Presenter: Kei Murayama – Shinko Electric Industries Co. Ltd.
• 4:10 PM – 4:30 PM ET

  Gradient-Based End-of-Life Criterion of Power Semiconductor Modules
  

  Technical Lecture Presenter: Yichi Zhang – Aalborg University
• 4:30 PM – 4:50 PM ET

  Lifetime Prediction in Power Semiconductor Devices: A Comparative Study Between Analytical Modeling and Artificial Neural Network
  

  Technical Lecture Presenter: Alessandro Vaccaro, PhD – University of Padova