Sentec Electro Ceramic & Device Group offers various substrate and IC packaging solutions.
Core technology:
‧Raw Material (Various Ceramic Material Options)
‧Multi-Layer Process (LTCC/ HTCC)
‧Thick & ThinFilm metallization
‧High Strength, High Thermal Conductivity & Low Loss Property Options
‧Ni/Pd/Au & Ag Plating
‧Module Packaging OEM Turnkey