Industry Session Lecture

8:30 AM – 11:55 AM ET

IS07 - Power Modules for Traction Drive Applications
Location: W203ABC

Industry Session Chair: Lincoln Xue – Oak Ridge National Lab

Industry Session Chair: Shajjad Chowdhury – Oak Ridge National Lab

8:30 AM – 8:55 AM ET

IS07.1 - Power-dense engine coolant capable 200kW 1050VDC inverter enabled by highly integrated six-pack SiC power module
Location: W203ABC

Industry Session Presenter: Brij N. Singh, PhD – John Deere

Power Modules for Traction Drive Applications

8:55 AM – 9:20 AM ET

IS07.2 - Advanced Substrate Materials for Power Modules
Location: W203ABC

Industry Session Presenter: Glenn Catlin – DuPont Silicon Valley Technology Center (SVTC)

Power Modules for Traction Drive Applications

9:20 AM – 9:45 AM ET

IS07.3 - Improving Heat Conduction of Insulated Metal Substrate with Advanced Ceramic Materials for SiC Power Module Packaging
Location: W203ABC

Industry Session Presenter: Wei Fan – Momentive Technologies Inc

Power Modules for Traction Drive Applications

9:45 AM – 10:10 AM ET

IS07.4 - Packaging of Double-Side Cooled SiC Power Module for 100 kW/Liter Traction Inverter
Location: W203ABC

Industry Session Presenter: Guo-Quan (GQ) Lu – Virginia Tech

Power Modules for Traction Drive Applications

10:40 AM – 11:05 AM ET

IS07.5 - Power Module Architectures for Traction Drive Applications
Location: W203ABC

Industry Session Presenter: Alan Mantooth – University of Arkansas

Power Modules for Traction Drive Applications

11:05 AM – 11:30 AM ET

IS07.6 - Power Module with Electrical and Thermal Integration
Location: W203ABC

Industry Session Presenter: Lincoln Xue – Oak Ridge National Lab

Power Modules for Traction Drive Applications

11:30 AM – 11:55 AM ET

IS07.7 - Thermomechanical Reliability Aspects of Automotive Power Electronics Current Status and Future Trends
Location: W203ABC

Industry Session Presenter: Douglas DeVoto – NREL

Power Modules for Traction Drive Applications

8:30 AM – 11:55 AM ET

IS08 - Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count
Location: W206

Industry Session Chair: Ajay Hari – Onsemi

Industry Session Chair: Llew Vaughan-Edmunds – Navitas Semiconductor

8:30 AM – 8:55 AM ET

IS08.1 - Power Steering Application Using eGaN® Integrated Circuit
Location: W206

Industry Session Presenter: Marco Palma – Efficient Power Conversion

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

8:55 AM – 9:20 AM ET

IS08.2 - Half Bridge GaN Power IC Simplify Active Clamp Fly-back Design for High Power Density Chargers
Location: W206

Industry Session Presenter: Brian King – Texas Instruments

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

9:20 AM – 9:45 AM ET

IS08.3 - High-Voltage GaN Power ICs: Strengths, Gaps, and Opportunities
Location: W206

Industry Session Presenter: Olivier Trescases – University of Toronto

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

9:45 AM – 10:10 AM ET

IS08.4 - Future Prospects on Monolithic GaN Versus Discrete GaN for Power
Location: W206

Industry Session Presenter: Mike IG Wens, PhD – MinDCet NV

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

10:40 AM – 11:05 AM ET

IS08.5 - Integrated GaN Solution for LV Applications: Bringing Efficiency and Operating Frequency to the Next Level
Location: W206

Industry Session Presenter: Pengju Kong – Innoscience

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

11:05 AM – 11:30 AM ET

IS08.6 - Integrated GaN Partitioning: Challenges and Solutions
Location: W206

Industry Session Presenter: Anthony Sanders – Infineon

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

11:30 AM – 11:55 AM ET

IS08.7 - Optimizing Your Plate at the Power Semiconductor Technology Buffet
Location: W206

Industry Session Presenter: Doug Bailey – Power Integrations

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

8:30 AM – 11:55 AM ET

IS09 - AC-DC Converter Applications
Location: W204ABC

Industry Session Chair: Francesco Di Domenico – Infineon Technologies

Industry Session Chair: Alessandro Pevere, PhD – Infineon Technologies

8:30 AM – 8:55 AM ET

IS09.1 - Control Challenges in a Totem Pole Bridgeless PFC
Location: W204ABC

Industry Session Presenter: Sheng-Yang Yu, PhD – Texas Instruments, Inc.

AC-DC Converter Applications

8:55 AM – 9:20 AM ET

IS09.2 - Compact and Efficient AC/DC Power Supply for Edge Computing Outdoor Applications
Location: W204ABC

Industry Session Presenter: Alessandro Pevere, PhD – Infineon Technologies

AC-DC Converter Applications

9:20 AM – 9:45 AM ET

IS09.3 - Design Optimization of Hybrid Technology PFC Stage in Bidirectional on Board Charger with WBG Power Semiconductors
Location: W204ABC

Industry Session Presenter: Giuseppe Aiello, PhD – STMicroelectronics

AC-DC Converter Applications

9:45 AM – 10:10 AM ET

IS09.4 - Comparison of ZVS Topologies for 250W AC/DC Battery Chargers
Location: W204ABC

Industry Session Presenter: Sarmad Abedin – texas instruments

AC-DC Converter Applications

10:40 AM – 11:05 AM ET

IS09.5 - EMI Filter and Modulation Optimization for Power Factor Correction in Avionic Applications
Location: W204ABC

Industry Session Presenter: Roberto Scibilia – TEXAS INSTRUMENTS

AC-DC Converter Applications

11:05 AM – 11:30 AM ET

IS09.6 - Comparison of Methods for Parallel Operation of Boost Power Factor Converters
Location: W204ABC

Industry Session Presenter: Richard Hester – Power Integrations

AC-DC Converter Applications

11:30 AM – 11:55 AM ET

IS09.7 - The Effect of Power Factor Correction (PFC) in Optimizing Efficiency and Regulation in a 720 W LLC Resonant SMPS
Location: W204ABC

Industry Session Presenter: MC De La Pena – Power Integrations

AC-DC Converter Applications

8:30 AM – 11:55 AM ET

IS10 - Latest 3D-Packaging Technology for Power Electronics
Location: W205BC

Industry Session Chair: John Bultitude – Kemet Corporation

Industry Session Chair: Brian Narveson – Narveson Innovative Consulting

8:30 AM – 8:55 AM ET

IS10.1 - Manufacturing Challenges and Qualification of 3D Packaging
Location: W205BC

Industry Session Presenter: Charles Woychik – Skywater Technology Foundry

Latest 3D-Packaging Technology for Power Electronics

8:55 AM – 9:20 AM ET

IS10.2 - Sintering Innovations for Power Electronics Packaging & Assembly
Location: W205BC

Industry Session Presenter: Gyan Dutt – MacDermid Alpha Electronics Solutions

Latest 3D-Packaging Technology for Power Electronics

9:20 AM – 9:45 AM ET

IS10.3 - Voice of the Customer presentation on Form Factor by IBM
Location: W205BC

Industry Session Presenter: Eric Swenson, MSEE – IBM

Latest 3D-Packaging Technology for Power Electronics

9:45 AM – 10:10 AM ET

IS10.4 - Aluminium liquid cooled heatsink and Friction Stir Welding (FSW): a high efficiency and low-cost solution for EV thermal management
Location: W205BC

Industry Session Presenter: Laurent Dubourg – Stirweld

Latest 3D-Packaging Technology for Power Electronics

10:40 AM – 11:05 AM ET

IS10.5 - Power Module Packaging Using Direct Write Technology
Location: W205BC

Industry Session Presenter: Mark Poliks – Binghamton University

Latest 3D-Packaging Technology for Power Electronics

11:05 AM – 11:30 AM ET

IS10.6 - Power Electronics Packaging - Engineering Art and System Perspective
Location: W205BC

Industry Session Presenter: Richard Zhang – Virginia Tech CPES

Latest 3D-Packaging Technology for Power Electronics

11:30 AM – 11:55 AM ET

IS10.7 - Scalable magnetic thin film multilayering technology for power inductor integration in laminates
Location: W205BC

Industry Session Presenter: Pulugurtha Raj – Florida International University

Latest 3D-Packaging Technology for Power Electronics

8:30 AM – 11:55 AM ET

IS11 - Motor Drives and Control
Location: W202BC

Industry Session Chair: Lei Han – Infineon Technologies

Industry Session Chair: Nathan Croft – IONA

8:30 AM – 8:55 AM ET

IS11.1 - High Frequency Impact on Electrical Motors and Drives
Location: W202BC

Industry Session Presenter: Eslam Alfawy – Infineon technologies AG

Motor Drives and Control

8:55 AM – 9:20 AM ET

IS11.2 - A Novel Method for Sensorless Control of a Single-Phase Brushless DC Motor Based on Flux Observation
Location: W202BC

Industry Session Presenter: John Emmanuel Tan – Power Integrations

Motor Drives and Control

9:20 AM – 9:45 AM ET

IS11.3 - Novel Alignment and Start-Up Methodology for Sensorless Single-Phase BLDC Motors with an Asymmetric Air Gap
Location: W202BC

Industry Session Presenter: Sharmaine Marcos – Power Integrations

Motor Drives and Control

9:45 AM – 10:10 AM ET

IS11.4 - Design Considerations for Ultra-High Speed 3-Phase Motor Drive Applications
Location: W202BC

Industry Session Presenter: Lei Han – Infineon Technologies

Motor Drives and Control

10:40 AM – 11:05 AM ET

IS11.5 - How to Test an Existing Power Supply for Stability and Dynamic Response
Location: W202BC

Industry Session Presenter: Josh Mandelcorn – Texas Instruments

Motor Drives and Control

11:05 AM – 11:30 AM ET

IS11.6 - Finite Control Set Model Predictive Control for Power Converters Enabled by Recent 32-bit Microcontrollers
Location: W202BC

Industry Session Presenter: Giuseppe Aiello, PhD – STMicroelectronics

Motor Drives and Control

11:30 AM – 11:55 AM ET

IS11.7 - Type III Voltage Compensation Strategy for Digital Average Current Control in Single-Phase Unipolar Inverters
Location: W202BC

Industry Session Presenter: Lotfi Beghou – DRS Pivotal Power Inc

Motor Drives and Control

8:30 AM – 11:55 AM ET

IS12 - Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry
Location: W205A

Industry Session Chair: Crystal Yannarella – L3Harris

Industry Session Chair: Brian Zahnstecher, ME – PowerRox LLC

8:30 AM – 8:55 AM ET

IS12.1 - Case for Standardized Mission Profiles for Automotive
Location: W205A

Industry Session Presenter: Peter Turlo – onsemi

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

8:55 AM – 9:20 AM ET

IS12.2 - The Safety-related Challenges of Using Lithium-ion Batteries
Location: W205A

Industry Session Presenter: Michael Pecht – UMD

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

9:20 AM – 9:45 AM ET

IS12.3 - 900V GaN –Designing for Reliability
Location: W205A

Industry Session Presenter: Likun Shen – Transphorm

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

9:45 AM – 10:10 AM ET

IS12.4 - A Heirarchy of Failure Modes affecting the reliability of Embedded Software in Marine Power Conversion Applications
Location: W205A

Industry Session Presenter: Benjamin Morris – L3Harris

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

10:40 AM – 11:05 AM ET

IS12.5 - Intelligent Design of Fanless Power Supplies for Optimizing Thermal Management
Location: W205A

Industry Session Presenter: Christoph Butzhammer – RECOM-Power

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

11:05 AM – 11:30 AM ET

IS12.6 - Impacts and Methods for Design Reliability in Military Power System Applications
Location: W205A

Industry Session Presenter: Joaquin Gabriels – L3Harris

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

11:30 AM – 11:55 AM ET

IS12.7 - Electrolytic Capacitors – how to make sure to achieve desired reliability and application life performance
Location: W205A

Industry Session Presenter: Stephan Menzel, MEng, MA – CapXon

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

1:30 PM – 4:45 PM ET

IS13 - Gate Driver Applications
Location: W206

Industry Session Chair: Joe Duigan – Allegro Microsystems

Industry Session Chair: Emanuel-Petre Eni, PhD – Infineon Technologies AG

1:30 PM – 1:55 PM ET

IS13.1 - Driving GaNFETS - a Comparative Overview
Location: W206

Industry Session Presenter: Bernard Keogh – Allegro Microsystems

Gate Driver Applications

1:55 PM – 2:20 PM ET

IS13.2 - Eliminating Unwanted Side Effects of Cross-Isolation Capacitance in High Power Switching
Location: W206

Industry Session Presenter: Long V. Nguyen, MS – Skyworks

Gate Driver Applications

2:20 PM – 2:45 PM ET

IS13.3 - Flexible SiC Gate Driver Power Supply Design Strategies
Location: W206

Industry Session Presenter: Brett Sparkman – Wolfspeed

Gate Driver Applications

2:45 PM – 3:10 PM ET

IS13.4 - How to Achieve High Power Density for Isolated Bias Supply of SiC/IGBT Gate Drivers
Location: W206

Industry Session Presenter: Dongbin Hou, PhD – Texas Instruments

Gate Driver Applications

3:30 PM – 3:55 PM ET

IS13.5 - How to Break an Isolated Gate Driver
Location: W206

Industry Session Presenter: Asa Kirby – Skyworks Solutions Inc.

Gate Driver Applications

3:55 PM – 4:20 PM ET

IS13.6 - NextGen Isolated Gate Driver Features for EV/HEV Traction Inverter
Location: W206

Industry Session Presenter: Andy Robles – Texas Instruments

Gate Driver Applications

4:20 PM – 4:45 PM ET

IS13.7 - Pushing the Frontiers of Wide-Bandgap Converters: High Performance SiC Gate-Driving
Location: W206

Industry Session Presenter: Mike IG Wens, PhD – MinDCet NV

Gate Driver Applications

1:30 PM – 4:45 PM ET

IS14 - DC-DC Converter Applications
Location: W203ABC

Industry Session Chair: Diego Raffo – Infineon Technologies

Industry Session Chair: Joseph Khayat – Texas Instruments

1:30 PM – 1:55 PM ET

IS14.1 - Integrated Smart GaN Device for Low Voltage Bidirectional Buck Converter in Mild Hybrid Applications
Location: W203ABC

Industry Session Presenter: Federica Cammarata – STMicroelectronics

DC-DC Converter Applications

1:55 PM – 2:20 PM ET

IS14.2 - Designing an LLC Resonant Converter for Audio Applications with High Peak Load
Location: W203ABC

Industry Session Presenter: Ben Lough – Texas Instruments

DC-DC Converter Applications

2:20 PM – 2:45 PM ET

IS14.3 - Evolution and Comparison of Magnetics for the Multiphase DC-DC Applications
Location: W203ABC

Industry Session Presenter: Alexandr Ikriannikov – Analog Devices

DC-DC Converter Applications

2:45 PM – 3:10 PM ET

IS14.4 - Achieving Low, 1-mV Output Voltage Ripple Noise from a 15-a Synchronous Buck Converter
Location: W203ABC

Industry Session Presenter: Richard Nowakowski – Texas Instruments

DC-DC Converter Applications

3:30 PM – 3:55 PM ET

IS14.5 - Best Practices for Driving High Power Parallel MOSFETs in a Half-Bridge Configuration
Location: W203ABC

Industry Session Presenter: Leslie Marquez Arroyo – Texas Instruments

DC-DC Converter Applications

3:55 PM – 4:20 PM ET

IS14.6 - Input Power Sharing and Limiting for Dual Input Power Over Ethernet Converters
Location: W203ABC

Industry Session Presenter: Darwin Fernandez – Texas Instruments

DC-DC Converter Applications

1:30 PM – 4:45 PM ET

IS15 - Industry Trends Driving Power Electronics
Location: W202BC

Industry Session Chair: Ada Cheng, BSEE MBA – Adaclock

Industry Session Chair: Dinesh Kithany, MBA – Wired & Wireless Technologies (WAWT)

1:30 PM – 1:55 PM ET

IS15.1 - A Peek Into Global Energy Revolution Policies Across Sectors
Location: W202BC

Industry Session Presenter: Michael Willis – The Color Nine Group