Industry Session Lecture

8:30 AM – 11:55 AM ET

IS01 - Core Loss Measurements for Different Materials and Excitations
Location: W203ABC

Industry Session Chair: Ed Herbert – PSMA

Industry Session Chair: George Slama – Würth Elektronik

8:31 AM – 8:55 AM ET

IS01.1 - Core loss mechanism in different soft magnetic materials
Location: W203ABC

Industry Session Presenter: Ranajit Sai

Core Loss Measurements for Different Materials and Excitations

8:55 AM – 9:20 AM ET

IS01.2 - Core loss measurement techniques to address impact of signal and frequency ranges
Location: W203ABC

Industry Session Presenter: Mike Ranjram – Arizona State University

Industry Session Presenter: Alex Hanson – UT Austin

Core Loss Measurements for Different Materials and Excitations

9:20 AM – 9:45 AM ET

IS01.3 - Core specifications vs. component specifications
Location: W203ABC

Industry Session Presenter: Bharadwaj Andapally – CBMM

Industry Session Presenter: Mark Nations – North Carolina State University

Core Loss Measurements for Different Materials and Excitations

9:45 AM – 10:10 AM ET

IS01.4 - Practical core loss measurements across different materials
Location: W203ABC

Industry Session Presenter: Dominic Heye – Dexter Magnetic Technologies

Core Loss Measurements for Different Materials and Excitations

10:40 AM – 11:05 AM ET

IS01.5 - Core loss measurements across power levels, frequencies and materials
Location: W203ABC

Industry Session Presenter: John Noble – Mag Inc

Core Loss Measurements for Different Materials and Excitations

11:05 AM – 11:30 AM ET

IS01.6 - Power loss measurements with non-sinusoidal waveforms
Location: W203ABC

Industry Session Presenter: Mike IG Wens, PhD – MinDCet NV

Core Loss Measurements for Different Materials and Excitations

11:30 AM – 11:55 AM ET

IS01.7 - Validating quality and verification of core loss measurements for databases
Location: W203ABC

Industry Session Presenter: Haoran Li – Princeton University

Core Loss Measurements for Different Materials and Excitations

8:30 AM – 11:55 AM ET

IS02 - Solutions for Data Center and Server Power
Location: W206

Industry Session Chair: Harry Soin – AEI

Industry Session Chair: Richard Chung – ST Microelectronics

8:30 AM – 8:55 AM ET

IS02.1 - Key Features of Next Generation 48 V Power and BBU Shelves Used in Datacenters
Location: W206

Industry Session Presenter: Harry Soin – AEI

Solutions for Data Center and Server Power

8:55 AM – 9:20 AM ET

IS02.2 - Using a Microcontroller-Based Hybrid Hysteretic Control (HHC) of an LLC Converter to Solve Transient Response Challenges in Server PSU Applications
Location: W206

Industry Session Presenter: Chen Jiang – Texas Instruments

Solutions for Data Center and Server Power

9:20 AM – 9:45 AM ET

IS02.3 - Design of a Compact Auxiliary Power Supply Using GaN for Server Applications
Location: W206

Industry Session Presenter: Brian King – Texas Instruments

Solutions for Data Center and Server Power

9:45 AM – 10:10 AM ET

IS02.4 - Data Center VR Power Delivery Solutions
Location: W206

Industry Session Presenter: Indumini Ranmuthu – Texas Instruments Inc.

Solutions for Data Center and Server Power

11:05 AM – 11:30 AM ET

IS02.6 - Immersion-Cooling Power Supply Unit for Data Center
Location: W206

Industry Session Presenter: Cai Youzhun – Delta electronic Shanghai Inc. Hangzhou Design Center

Solutions for Data Center and Server Power

11:30 AM – 11:55 AM ET

IS02.7 - Tips and Tricks to Improve the Density and Performance of a Data Center PSU
Location: W206

Industry Session Presenter: Yifei Zheng – Infineon Technologies

Solutions for Data Center and Server Power

8:30 AM – 11:55 AM ET

IS03 - Modern Power Semiconductor Technology Ambitions & Applications
Location: W204ABC

Industry Session Chair: Sandeep Bahl, PhD – Texas Instruments

Industry Session Chair: Renee Yawger – Efficient Power Conversion Corporation (EPC)

8:30 AM – 8:55 AM ET

IS03.1 - High-Power 650-V and 1200-V GaN Devices for EVs Applications
Location: W204ABC

Industry Session Presenter: Davide Bisi, PhD – Transphorm Inc.

Modern Power Semiconductor Technology Ambitions & Applications

8:55 AM – 9:20 AM ET

IS03.2 - Impact of SiC Power Devices on Emerging Applications and Mainstream Trends
Location: W204ABC

Industry Session Presenter: Peter Friedrichs, PhD – Infineon Technologies AG

Modern Power Semiconductor Technology Ambitions & Applications

9:20 AM – 9:45 AM ET

IS03.3 - Using Test to Fail Methodology to Accurately Predict How Enhancement Mode GaN Devices Can Last More than 25 Years in Solar Applications
Location: W204ABC

Industry Session Presenter: Shengke Zhang – Efficient Power Conversion

Modern Power Semiconductor Technology Ambitions & Applications

9:45 AM – 10:10 AM ET

IS03.4 - Microchip SiC-Based Auxiliary E-Fuse Overview
Location: W204ABC

Industry Session Presenter: Ehab Tarmoom – Microchip

Modern Power Semiconductor Technology Ambitions & Applications

10:40 AM – 11:05 AM ET

IS03.5 - Performance Analysis and Cost Comparison of High-Efficiency Power Factor Correction Topologies for High Power AC/DC Converters
Location: W204ABC

Industry Session Presenter: Chi Xu – Texas Instruments

Modern Power Semiconductor Technology Ambitions & Applications

11:05 AM – 11:30 AM ET

IS03.6 - An Overview of GaN Dynamic Rds(ON) and Quantifying Performance considerations in Applications
Location: W204ABC

Industry Session Presenter: Daniel Popa

Modern Power Semiconductor Technology Ambitions & Applications

11:30 AM – 11:55 AM ET

IS03.7 - High Performance GaN Switches for LV and HV Applications on Cost-optimized 8-inch GaN-on-Si Technology Platforms
Location: W204ABC

Industry Session Presenter: Denis Marcon, PhD – Innoscience

Modern Power Semiconductor Technology Ambitions & Applications

8:30 AM – 11:55 AM ET

IS04 - Wireless Power Industry Showcase
Location: W205A

Industry Session Chair: Sanjay Gupta – AirFuel Alliance

Industry Session Chair: Trish Thomas – AirFuel Alliance

8:30 AM – 8:55 AM ET

IS04.1 - How GaN is Advancing Wireless Power Technology
Location: W205A

Industry Session Presenter: Paul Wiener – GaN Systems

Wireless Power Industry Showcase

8:55 AM – 9:20 AM ET

IS04.2 - Wireless Power for Automotive Applications
Location: W205A

Industry Session Presenter: Josh Yank – Yank Technologies

Wireless Power Industry Showcase

9:20 AM – 9:45 AM ET

IS04.3 - Magically Convenient Wireless EV Charging
Location: W205A

Industry Session Presenter: Milisav Danilovic, PhD – WiTricity

Wireless Power Industry Showcase

9:45 AM – 10:10 AM ET

IS04.4 - Charging the Future of IoT
Location: W205A

Industry Session Presenter: Cesar Johnston – Energous

Wireless Power Industry Showcase

10:40 AM – 11:05 AM ET

IS04.5 - Energy Harvesting is the Future of IoT
Location: W205A

Industry Session Presenter: Nick Dutton – Atmosic

Wireless Power Industry Showcase

11:05 AM – 11:30 AM ET

IS04.6 - Ambient IoT – The Path to Connecting Trillions of Things
Location: W205A

Industry Session Presenter: Steve Statler – Wiliot / Bluetooth SiG

Wireless Power Industry Showcase

11:30 AM – 11:55 AM ET

IS04.7 - The Future of Wireless Power
Location: W205A

Industry Session Presenter: Sanjay Gupta – AirFuel Alliance

Wireless Power Industry Showcase

8:30 AM – 11:55 AM ET

IS05 - Power Innovations and Technologies Enabling Smart Buildings and Cities
Location: W205BC

Industry Session Chair: David Chen, SM – Power Integrations

Industry Session Chair: Lincoln Xue – Oak Ridge National Lab

8:30 AM – 8:55 AM ET

IS05.1 - Reimagine Architecture, Functionality, and Sustainability of Power Technology for Smart Buildings and Cities
Location: W205BC

Industry Session Presenter: Lincoln Xue – Oak Ridge National Lab

Power Innovations and Technologies Enabling Smart Buildings and Cities

8:55 AM – 9:20 AM ET

IS05.2 - Fault Analysis and Predictive Maintenance for BLDC motors
Location: W205BC

Industry Session Presenter: John Emmanuel Tan – Power Integrations

Power Innovations and Technologies Enabling Smart Buildings and Cities

9:20 AM – 9:45 AM ET

IS05.3 - Micro-power Energy Harvesting for Retrofitted Wireless Sensors in Buildings
Location: W205BC

Industry Session Presenter: Mike Hayes, MEngSc – Tyndall National Institute

Power Innovations and Technologies Enabling Smart Buildings and Cities

9:45 AM – 10:10 AM ET

IS05.4 - Powering Future Indoor Farming Facilities
Location: W205BC

Industry Session Presenter: Frank Cirolia – Advanced Energy

Power Innovations and Technologies Enabling Smart Buildings and Cities

10:40 AM – 11:05 AM ET

IS05.5 - Bidirectional Wireless Power Transfer System Design and Integration for Medium-Duty Electric Vehicles
Location: W205BC

Industry Session Presenter: Omer C. Onar – Oak Ridge National Laboratory

Power Innovations and Technologies Enabling Smart Buildings and Cities

11:05 AM – 11:30 AM ET

IS05.6 - Meeting Carbon Goals with GaN
Location: W205BC

Industry Session Presenter: Giorgia Longobardi, PhD – Cambridge GaN Devices

Power Innovations and Technologies Enabling Smart Buildings and Cities

11:30 AM – 11:55 AM ET

IS05.7 - Grid-interactive Modeling and Community-scale Energy Planning
Location: W205BC

Industry Session Presenter: Ben Polly – National Renewable Energy Laboratory

Power Innovations and Technologies Enabling Smart Buildings and Cities

8:30 AM – 11:55 AM ET

IS06 - Other Perspectives of Power Electronics - Markets, Society and Policies
Location: W202BC

Industry Session Chair: Stephen Oliver, MBA – Navitas Semiconductor

Industry Session Chair: Elena Barbarini – System Plus Consulting

8:30 AM – 8:55 AM ET

IS06.1 - How to Protect Your Valuable Intellectual Property (IP)
Location: W202BC

Industry Session Presenter: Brian Rosenbloom – Rothwell Figg

Other Perspectives of Power Electronics - Markets, Society and Policies

8:55 AM – 9:20 AM ET

IS06.2 - EV Powertrain Trends - Now and in the Future
Location: W202BC

Industry Session Presenter: Milan Rosina – Yole Intelligence

Other Perspectives of Power Electronics - Markets, Society and Policies

9:20 AM – 9:45 AM ET

IS06.3 - State of the Art of SiC Transistors and Modules: Technology and Cost Overview
Location: W202BC

Industry Session Presenter: Elena Barbarini – System Plus Consulting

Other Perspectives of Power Electronics - Markets, Society and Policies

9:45 AM – 10:10 AM ET

IS06.4 - The Past, Present, and Future of Current Sensing
Location: W202BC

Industry Session Presenter: John Stevens – NAVITAS SEMICONDUCTOR

Other Perspectives of Power Electronics - Markets, Society and Policies

10:40 AM – 11:05 AM ET

IS06.5 - Sustainability Benefits of GaNFast Power ICs
Location: W202BC

Industry Session Presenter: Anthony Schiro – Navitas Semiconductor

Other Perspectives of Power Electronics - Markets, Society and Policies

11:05 AM – 11:30 AM ET

IS06.6 - How Do Vehicle System Level Considerations Affect Power Electronic Technology Choices and Market
Location: W202BC

Industry Session Presenter: Adam Dawson – Exawatt

Other Perspectives of Power Electronics - Markets, Society and Policies

11:30 AM – 11:55 AM ET

IS06.7 - Power Electronics Role in Future Hydrogen Systems
Location: W202BC

Industry Session Presenter: Ahmed Abdelhakim – ABB

Other Perspectives of Power Electronics - Markets, Society and Policies

8:30 AM – 11:55 AM ET

IS07 - Power Modules for Traction Drive Applications
Location: W203ABC

Industry Session Chair: Lincoln Xue – Oak Ridge National Lab

Industry Session Chair: Shajjad Chowdhury – Oak Ridge National Lab

8:30 AM – 8:55 AM ET

IS07.1 - Power-dense engine coolant capable 200kW 1050VDC inverter enabled by highly integrated six-pack SiC power module
Location: W203ABC

Industry Session Presenter: Brij N. Singh, PhD – John Deere

Power Modules for Traction Drive Applications

8:55 AM – 9:20 AM ET

IS07.2 - Advanced Substrate Materials for Power Modules
Location: W203ABC

Industry Session Presenter: Glenn Catlin – DuPont Silicon Valley Technology Center (SVTC)

Power Modules for Traction Drive Applications

9:20 AM – 9:45 AM ET

IS07.3 - Improving Heat Conduction of Insulated Metal Substrate with Advanced Ceramic Materials for SiC Power Module Packaging
Location: W203ABC

Industry Session Presenter: Wei Fan – Momentive Technologies Inc

Power Modules for Traction Drive Applications

9:45 AM – 10:10 AM ET

IS07.4 - Packaging of Double-Side Cooled SiC Power Module for 100 kW/Liter Traction Inverter
Location: W203ABC

Industry Session Presenter: Guo-Quan (GQ) Lu – Virginia Tech

Power Modules for Traction Drive Applications

10:40 AM – 11:05 AM ET

IS07.5 - Power Module Architectures for Traction Drive Applications
Location: W203ABC

Industry Session Presenter: Alan Mantooth – University of Arkansas

Power Modules for Traction Drive Applications

11:05 AM – 11:30 AM ET

IS07.6 - Power Module with Electrical and Thermal Integration
Location: W203ABC

Industry Session Presenter: Lincoln Xue – Oak Ridge National Lab

Power Modules for Traction Drive Applications

11:30 AM – 11:55 AM ET

IS07.7 - Thermomechanical Reliability Aspects of Automotive Power Electronics Current Status and Future Trends
Location: W203ABC

Industry Session Presenter: Douglas DeVoto – NREL

Power Modules for Traction Drive Applications

8:30 AM – 11:55 AM ET

IS08 - Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count
Location: W206

Industry Session Chair: Ajay Hari – Onsemi

Industry Session Chair: Llew Vaughan-Edmunds – Navitas Semiconductor

8:30 AM – 8:55 AM ET

IS08.1 - Power Steering Application Using eGaN® Integrated Circuit
Location: W206

Industry Session Presenter: Marco Palma – Efficient Power Conversion

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

8:55 AM – 9:20 AM ET

IS08.2 - Half Bridge GaN Power IC Simplify Active Clamp Fly-back Design for High Power Density Chargers
Location: W206

Industry Session Presenter: Brian King – Texas Instruments

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

9:20 AM – 9:45 AM ET

IS08.3 - High-Voltage GaN Power ICs: Strengths, Gaps, and Opportunities
Location: W206

Industry Session Presenter: Olivier Trescases – University of Toronto

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

9:45 AM – 10:10 AM ET

IS08.4 - Future Prospects on Monolithic GaN Versus Discrete GaN for Power
Location: W206

Industry Session Presenter: Mike IG Wens, PhD – MinDCet NV

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

10:40 AM – 11:05 AM ET

IS08.5 - Integrated GaN Solution for LV Applications: Bringing Efficiency and Operating Frequency to the Next Level
Location: W206

Industry Session Presenter: Pengju Kong – Innoscience

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

11:05 AM – 11:30 AM ET

IS08.6 - Integrated GaN Partitioning: Challenges and Solutions
Location: W206

Industry Session Presenter: Anthony Sanders – Infineon

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

11:30 AM – 11:55 AM ET

IS08.7 - Optimizing Your Plate at the Power Semiconductor Technology Buffet
Location: W206

Industry Session Presenter: Doug Bailey – Power Integrations

Integrated WBG Semiconductors - Enhancing Power Density and Reducing Part Count

8:30 AM – 11:55 AM ET

IS09 - AC-DC Converter Applications
Location: W204ABC

Industry Session Chair: Francesco Di Domenico – Infineon Technologies

Industry Session Chair: Alessandro Pevere, PhD – Infineon Technologies

8:30 AM – 8:55 AM ET

IS09.1 - Control Challenges in a Totem Pole Bridgeless PFC
Location: W204ABC

Industry Session Presenter: Sheng-Yang Yu, PhD – Texas Instruments, Inc.

AC-DC Converter Applications

8:55 AM – 9:20 AM ET

IS09.2 - Compact and Efficient AC/DC Power Supply for Edge Computing Outdoor Applications
Location: W204ABC

Industry Session Presenter: Alessandro Pevere, PhD – Infineon Technologies

AC-DC Converter Applications

9:20 AM – 9:45 AM ET

IS09.3 - Design Optimization of Hybrid Technology PFC Stage in Bidirectional on Board Charger with WBG Power Semiconductors
Location: W204ABC

Industry Session Presenter: Giuseppe Aiello, PhD – STMicroelectronics

AC-DC Converter Applications

9:45 AM – 10:10 AM ET

IS09.4 - Comparison of ZVS Topologies for 250W AC/DC Battery Chargers
Location: W204ABC

Industry Session Presenter: Sarmad Abedin – texas instruments

AC-DC Converter Applications

10:40 AM – 11:05 AM ET

IS09.5 - EMI Filter and Modulation Optimization for Power Factor Correction in Avionic Applications
Location: W204ABC

Industry Session Presenter: Roberto Scibilia – TEXAS INSTRUMENTS

AC-DC Converter Applications

11:05 AM – 11:30 AM ET

IS09.6 - Comparison of Methods for Parallel Operation of Boost Power Factor Converters
Location: W204ABC

Industry Session Presenter: Richard Hester – Power Integrations

AC-DC Converter Applications

11:30 AM – 11:55 AM ET

IS09.7 - The Effect of Power Factor Correction (PFC) in Optimizing Efficiency and Regulation in a 720 W LLC Resonant SMPS
Location: W204ABC

Industry Session Presenter: MC De La Pena – Power Integrations

AC-DC Converter Applications

8:30 AM – 11:55 AM ET

IS10 - Latest 3D-Packaging Technology for Power Electronics
Location: W205BC

Industry Session Chair: John Bultitude – Kemet Corporation

Industry Session Chair: Brian Narveson – Narveson Innovative Consulting

8:30 AM – 8:55 AM ET

IS10.1 - Manufacturing Challenges and Qualification of 3D Packaging
Location: W205BC

Industry Session Presenter: Charles Woychik – Skywater Technology Foundry

Latest 3D-Packaging Technology for Power Electronics

8:55 AM – 9:20 AM ET

IS10.2 - Sintering Innovations for Power Electronics Packaging & Assembly
Location: W205BC

Industry Session Presenter: Gyan Dutt – MacDermid Alpha Electronics Solutions

Latest 3D-Packaging Technology for Power Electronics

9:20 AM – 9:45 AM ET

IS10.3 - Voice of the Customer presentation on Form Factor by IBM
Location: W205BC

Industry Session Presenter: Eric Swenson, MSEE – IBM

Latest 3D-Packaging Technology for Power Electronics

9:45 AM – 10:10 AM ET

IS10.4 - Aluminium liquid cooled heatsink and Friction Stir Welding (FSW): a high efficiency and low-cost solution for EV thermal management
Location: W205BC

Industry Session Presenter: Laurent Dubourg – Stirweld

Latest 3D-Packaging Technology for Power Electronics

10:40 AM – 11:05 AM ET

IS10.5 - Power Module Packaging Using Direct Write Technology
Location: W205BC

Industry Session Presenter: Mark Poliks – Binghamton University

Latest 3D-Packaging Technology for Power Electronics

11:05 AM – 11:30 AM ET

IS10.6 - Power Electronics Packaging - Engineering Art and System Perspective
Location: W205BC

Industry Session Presenter: Richard Zhang – Virginia Tech CPES

Latest 3D-Packaging Technology for Power Electronics

11:30 AM – 11:55 AM ET

IS10.7 - Scalable magnetic thin film multilayering technology for power inductor integration in laminates
Location: W205BC

Industry Session Presenter: Pulugurtha Raj – Florida International University

Latest 3D-Packaging Technology for Power Electronics

8:30 AM – 11:55 AM ET

IS11 - Motor Drives and Control
Location: W202BC

Industry Session Chair: Lei Han – Infineon Technologies

Industry Session Chair: Nathan Croft – IONA

8:30 AM – 8:55 AM ET

IS11.1 - High Frequency Impact on Electrical Motors and Drives
Location: W202BC

Industry Session Presenter: Eslam Alfawy – Infineon technologies AG

Motor Drives and Control

8:55 AM – 9:20 AM ET

IS11.2 - A Novel Method for Sensorless Control of a Single-Phase Brushless DC Motor Based on Flux Observation
Location: W202BC

Industry Session Presenter: John Emmanuel Tan – Power Integrations

Motor Drives and Control

9:20 AM – 9:45 AM ET

IS11.3 - Novel Alignment and Start-Up Methodology for Sensorless Single-Phase BLDC Motors with an Asymmetric Air Gap
Location: W202BC

Industry Session Presenter: Sharmaine Marcos – Power Integrations

Motor Drives and Control

9:45 AM – 10:10 AM ET

IS11.4 - Design Considerations for Ultra-High Speed 3-Phase Motor Drive Applications
Location: W202BC

Industry Session Presenter: Lei Han – Infineon Technologies

Motor Drives and Control

10:40 AM – 11:05 AM ET

IS11.5 - How to Test an Existing Power Supply for Stability and Dynamic Response
Location: W202BC

Industry Session Presenter: Josh Mandelcorn – Texas Instruments

Motor Drives and Control

11:05 AM – 11:30 AM ET

IS11.6 - Finite Control Set Model Predictive Control for Power Converters Enabled by Recent 32-bit Microcontrollers
Location: W202BC

Industry Session Presenter: Giuseppe Aiello, PhD – STMicroelectronics

Motor Drives and Control

11:30 AM – 11:55 AM ET

IS11.7 - Type III Voltage Compensation Strategy for Digital Average Current Control in Single-Phase Unipolar Inverters
Location: W202BC

Industry Session Presenter: Lotfi Beghou – DRS Pivotal Power Inc

Motor Drives and Control

8:30 AM – 11:55 AM ET

IS12 - Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry
Location: W205A

Industry Session Chair: Crystal Yannarella – L3Harris

Industry Session Chair: Brian Zahnstecher, ME – PowerRox LLC

8:30 AM – 8:55 AM ET

IS12.1 - Case for Standardized Mission Profiles for Automotive
Location: W205A

Industry Session Presenter: Peter Turlo – onsemi

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

8:55 AM – 9:20 AM ET

IS12.2 - The Safety-related Challenges of Using Lithium-ion Batteries
Location: W205A

Industry Session Presenter: Michael Pecht – UMD

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

9:20 AM – 9:45 AM ET

IS12.3 - 900V GaN –Designing for Reliability
Location: W205A

Industry Session Presenter: Likun Shen – Transphorm

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

9:45 AM – 10:10 AM ET

IS12.4 - A Heirarchy of Failure Modes affecting the reliability of Embedded Software in Marine Power Conversion Applications
Location: W205A

Industry Session Presenter: Benjamin Morris – L3Harris

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

10:40 AM – 11:05 AM ET

IS12.5 - Intelligent Design of Fanless Power Supplies for Optimizing Thermal Management
Location: W205A

Industry Session Presenter: Christoph Butzhammer – RECOM-Power

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

11:05 AM – 11:30 AM ET

IS12.6 - Impacts and Methods for Design Reliability in Military Power System Applications
Location: W205A

Industry Session Presenter: Joaquin Gabriels – L3Harris

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

11:30 AM – 11:55 AM ET

IS12.7 - Electrolytic Capacitors – how to make sure to achieve desired reliability and application life performance
Location: W205A

Industry Session Presenter: Stephan Menzel, MEng, MA – CapXon

Reliability - the Good, the Bad, the Risky in Preventing Catastrophe in the Industry

1:30 PM – 4:45 PM ET

IS13 - Gate Driver Applications
Location: W206

Industry Session Chair: Joe Duigan – Allegro Microsystems

Industry Session Chair: Emanuel-Petre Eni, PhD – Infineon Technologies AG

1:30 PM – 1:55 PM ET

IS13.1 - Driving GaNFETS - a Comparative Overview
Location: W206

Industry Session Presenter: Bernard Keogh – Allegro Microsystems

Gate Driver Applications

1:55 PM – 2:20 PM ET

IS13.2 - Eliminating Unwanted Side Effects of Cross-Isolation Capacitance in High Power Switching
Location: W206

Industry Session Presenter: Long V. Nguyen, MS – Skyworks

Gate Driver Applications

2:20 PM – 2:45 PM ET

IS13.3 - Flexible SiC Gate Driver Power Supply Design Strategies
Location: W206

Industry Session Presenter: Brett Sparkman – Wolfspeed

Gate Driver Applications

2:45 PM – 3:10 PM ET

IS13.4 - How to Achieve High Power Density for Isolated Bias Supply of SiC/IGBT Gate Drivers
Location: W206

Industry Session Presenter: Dongbin Hou, PhD – Texas Instruments

Gate Driver Applications

3:30 PM – 3:55 PM ET

IS13.5 - How to Break an Isolated Gate Driver
Location: W206

Industry Session Presenter: Asa Kirby – Skyworks Solutions Inc.

Gate Driver Applications

3:55 PM – 4:20 PM ET

IS13.6 - NextGen Isolated Gate Driver Features for EV/HEV Traction Inverter
Location: W206

Industry Session Presenter: Andy Robles – Texas Instruments

Gate Driver Applications

4:20 PM – 4:45 PM ET

IS13.7 - Pushing the Frontiers of Wide-Bandgap Converters: High Performance SiC Gate-Driving
Location: W206

Industry Session Presenter: Mike IG Wens, PhD – MinDCet NV

Gate Driver Applications

1:30 PM – 4:45 PM ET

IS14 - DC-DC Converter Applications
Location: W203ABC

Industry Session Chair: Diego Raffo – Infineon Technologies

Industry Session Chair: Joseph Khayat – Texas Instruments

1:30 PM – 1:55 PM ET

IS14.1 - Integrated Smart GaN Device for Low Voltage Bidirectional Buck Converter in Mild Hybrid Applications
Location: W203ABC

Industry Session Presenter: Federica Cammarata – STMicroelectronics

DC-DC Converter Applications

1:55 PM – 2:20 PM ET

IS14.2 - Designing an LLC Resonant Converter for Audio Applications with High Peak Load
Location: W203ABC

Industry Session Presenter: Ben Lough – Texas Instruments

DC-DC Converter Applications

2:20 PM – 2:45 PM ET

IS14.3 - Evolution and Comparison of Magnetics for the Multiphase DC-DC Applications
Location: W203ABC

Industry Session Presenter: Alexandr Ikriannikov – Analog Devices

DC-DC Converter Applications

2:45 PM – 3:10 PM ET

IS14.4 - Achieving Low, 1-mV Output Voltage Ripple Noise from a 15-a Synchronous Buck Converter
Location: W203ABC

Industry Session Presenter: Richard Nowakowski – Texas Instruments

DC-DC Converter Applications

3:30 PM – 3:55 PM ET

IS14.5 - Best Practices for Driving High Power Parallel MOSFETs in a Half-Bridge Configuration
Location: W203ABC

Industry Session Presenter: Leslie Marquez Arroyo – Texas Instruments

DC-DC Converter Applications

3:55 PM – 4:20 PM ET

IS14.6 - Input Power Sharing and Limiting for Dual Input Power Over Ethernet Converters
Location: W203ABC

Industry Session Presenter: Darwin Fernandez – Texas Instruments

DC-DC Converter Applications

1:30 PM – 4:45 PM ET

IS15 - Industry Trends Driving Power Electronics
Location: W202BC

Industry Session Chair: Ada Cheng, BSEE MBA – Adaclock

Industry Session Chair: Dinesh Kithany, MBA – Wired & Wireless Technologies (WAWT)

1:30 PM – 1:55 PM ET

IS15.1 - A Peek Into Global Energy Revolution Policies Across Sectors
Location: W202BC

Industry Session Presenter: Michael Willis – The Color Nine Group