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Wednesday, Mar 22
8:30 AM – 8:55 AM ET

IS10.1 - Manufacturing Challenges and Qualification of 3D Packaging
Location: W205BC
Industry Session Presenter: Charles Woychik – Skywater Technology Foundry
Latest 3D-Packaging Technology for Power Electronics
Wednesday, Mar 22
8:55 AM – 9:20 AM ET

IS10.2 - Sintering Innovations for Power Electronics Packaging & Assembly
Location: W205BC
Industry Session Presenter: Gyan Dutt – MacDermid Alpha Electronics Solutions
Latest 3D-Packaging Technology for Power Electronics
Wednesday, Mar 22
9:20 AM – 9:45 AM ET

IS10.3 - Voice of the Customer presentation on Form Factor by IBM
Location: W205BC
Industry Session Presenter: Eric Swenson, MSEE – IBM
Latest 3D-Packaging Technology for Power Electronics
Wednesday, Mar 22
9:45 AM – 10:10 AM ET

IS10.4 - Aluminium liquid cooled heatsink and Friction Stir Welding (FSW): a high efficiency and low-cost solution for EV thermal management
Location: W205BC
Industry Session Presenter: Laurent Dubourg – Stirweld
Latest 3D-Packaging Technology for Power Electronics
Wednesday, Mar 22
10:40 AM – 11:05 AM ET

IS10.5 - Power Module Packaging Using Direct Write Technology
Location: W205BC
Industry Session Presenter: Mark Poliks – Binghamton University
Latest 3D-Packaging Technology for Power Electronics
Wednesday, Mar 22
11:05 AM – 11:30 AM ET

IS10.6 - Power Electronics Packaging - Engineering Art and System Perspective
Location: W205BC
Industry Session Presenter: Richard Zhang – Virginia Tech CPES
Latest 3D-Packaging Technology for Power Electronics
Wednesday, Mar 22
11:30 AM – 11:55 AM ET

IS10.7 - Scalable magnetic thin film multilayering technology for power inductor integration in laminates
Location: W205BC
Industry Session Presenter: Pulugurtha Raj – Florida International University
Latest 3D-Packaging Technology for Power Electronics