Session 3.1: Probecard Challenges for Expanding Arrays of Fine Pad Pitch Device to Test Under Wide Temperature Range

Semiconductor manufacturers are on a relentless drive to reduce the total cost of test at sort. A major contributor to reducing cost of test is increasing simulations Device Under Test which requires a subsequent increase in the probe card active area. For wire bond applications, increasing the active area must also meet the requirements of an extremely wide temperature range, very fine pitch and electrical performance. These factors. Along with other considerations, increases the probe card design complexity exponentially.
Vertical probe card solutions must evolve to meet these new testing challenges both at architectural and probe level. Probe card architectures need to be managed for mechanical stresses and CTE match between substrate and guide plates, support electrical performance requirements to meet device test requirements and achieve increased spring count requirements.
FormFactor has developed a new probe card architecture that meets these challenges. The recently qualified 60um pitch probe card architecture has been developed to address the challenges of fine pitch, high CCC, high temperature range for wire bond probing applications. Additionally, the new architecture incorporates the benefits of an optimized 60um capable MEMS vertical spring, optimal material selection and automated manufacturing processes which provides superior lifetime, stable CRES and tighter pin-pad alignment.