mm-Wave Systems Architect Teradyne, Massachusetts, United States
Antenna-in-package (AiP) DUTs are now common in high volume consumer products like mobile phones. AiP devices are physically customized to meet the criteria of specific end products and the test mechanics vary to suit the DUT--so there is no one-size-fits all solution. In this fast-paced market, one where product iterations happen on an annual or faster pace, the ability to develop custom tester mechanics that meet radiated electro-magnetic performance goals is needed. . We will present a workflow that develops custom, handler-based solutions for AiP DUT testing that is suitable for use in very high volume and compatible with the demands of fast time-to-market (TTM). We will present our method to quickly generate a customized mechanical design that meets radiated test performance goals. Our workflow 1) uses electrical performance goals to establish mechanical constraints, 2) creates EM simulations to validate the design, and 3) generates the CAD files necessary to build the customized solution. The resulting solution takes advantage of existing vendor eco-system together with custom EM-components and is ready for use with standard handlers and ATE to support 5G FR2, radar, 802.11ad/ay, and other AiP DUTs. Using a 60 GHz AiP DUT we will demonstrate the rapid design and validation of high volume change kits from start to finish using custom simulation tools together with off-the-shelf tools like SolidWorks™ and HFSS™. Results from our custom interactive design tool predictions will be compared with HFSS simulations of the actual mechanical design. Measurement results of a 60 GHz AiP device on a designed and fabricated 8-site handler change kit with our 60 GHz ATE instrumentation will be presented.
