Flexible Conductive Materials & Inks

Session Moderator(s)

• 

  Stephen Farias, PhD

  Chief Science Officer
  Materic Group, MD, United States

Presentations:

• 9:00am – 9:25am

  Advanced Prototype Fabrication Using ELMNT Liquid Metal Inks
  

  Speaker: Rob Dietrich – UES
• 9:25am – 9:50am

  High-temperature Cu Ink Material and All-printed Conformal Electronics
  

  Speaker: Shenqiang Ren, PhD – University at Buffalo, The State University of New York
• 9:50am – 10:15am

  High Performance Flexible Thin Film Transistors on Metal Foil Substrate
  

  Speaker: Bo Yu – University of Houston
• 10:15am – 10:40am

  Advanced Materials Enabling Next Generation Design for Flexible, Foldable, and Rollable Display
  

  Speaker: Xiaofeng Chen, PhD – C3Nano
• 10:40am – 11:05am

  Multi-jet Compatible Low Temperature Sintering Gold Nanoinks for Epidermal Electronics
  

  Speaker: Tony Varghese, PhD – Boise State University, INFlex Labs
• 11:05am – 11:45am

  Flexible Conductive Materials & Inks Panel Discussion
  

  Moderator: Stephen Farias, PhD – Materic Group

  Panelist: Rob Dietrich – UES

  Panelist: Shenqiang Ren, PhD – University at Buffalo, The State University of New York

  Panelist: Bo Yu – University of Houston

  Panelist: Xiaofeng Chen, PhD – C3Nano

  Panelist: Tony Varghese, PhD – Boise State University, INFlex Labs