Flexible Hybrid Electronics (FHE) is attractive for usage in a variety of extreme environments including wing surfaces, space environments, and human wearables due to their mechanical compliance and low size and weight. To survive in such environments, the electronics must be robust against stressors such as mechanical strain, humidity, temperature cycling, and saline. We know that some of the failure mechanisms are different than those of PCBA with soldered components. Building on the knowledge of failure mechanisms in rigid and flexible PCBA, NextFlex has kicked off a long-term project to understand the reliability and yield of FHE systems. In this project, we are testing FHE test vehicles in the environments mentioned above, but further, we are creating a set of automated processes in which statistical and application-relevant data can be efficiently captured. This project will define the operating boundaries, qualify materials and processes, and will create the framework to qualify new materials and processes. In this talk, we will discuss the initial findings of the project including initial temperature and humidity measurements, temperature cycling, and mechanical cycling, as well as process variables such as force, temperature, and time.
