Flexible Hybrid Electronics for System Level Electronics Integration and Packaging

Flexible Hybrid Electronics (FHE) combines a variety of processes coming from industries such as conventional electronics manufacturing, printing, plastics processing, additive manufacturing, laser imaging and robotic assembly. It combines thinned dies, printed components, flexible, conformal materials for electronics enabling new shapes and form factors. This presentation will discuss the system-level integration and packaging implementations in 3 example devices that NextFlex has developed with partners at the consortium’s Technology Hub. The talk will address design methodology and the unified manufacturing process flow used on the devices including additive printing, assembly, test, and final encapsulation. Both planar and conformal device integration and packaging will be shown.