Expo Plus Pass
Thought Leadership Pass
All-In Pass
Michael Corbett, MBA
Managing Partner
Linx Consulting, NJ, United States
Nabil Mistkawi, PhD
Senior Staff Engineer/Technologist
Samsung Austin Semiconductor
Ian Brown, PhD Chemical Engineering
Vice President Engineering
SCREEN, OR, United States
Aviram Tam, MSc
Head of Product Marketing, Patterning Control Division
Applied Materials
Mark Thirsk, MBA
Managing Partner
Linx Consulting, MA, United States
Device makers are enabling higher performance chips by utilizing more complicated architectures and device structures with 3-dimensional designs. With new demanding Gate all around (GAA), 3D NAND and 3D DRAM designs, process equipment and metrology tool suppliers are being tasked with ever increasingly complexity and challenges for higher reliability. Materials suppliers are being asked for greater traceability and more stringent requirements for finer and purer chemicals. All suppliers are challenged to meet throughput process times to meet the ravenous market for more compute power, memory capacity and bandwidth. This program will bring together some of the leaders in the field to discuss the unique challenges for their segment of the ecosystem – leaving it to the audience to challenge their assertions in a lengthy panel discussion on how all companies can be ready for the design shifts occurring.
Session Moderator: Michael Corbett, MBA – Linx Consulting
Speaker: Nabil G. Mistkawi, PhD – Samsung Austin Semiconductor
Speaker: Ian Brown, PhD Chemical Engineering – SCREEN
Speaker: Aviram Tam, MSc – Applied Materials
Panel Session Moderator: Mark Thirsk, MBA – Linx Consulting
Panelist: Ian Brown, PhD Chemical Engineering – SCREEN
Speaker: Nabil G. Mistkawi, PhD – Samsung Austin Semiconductor
Speaker: Aviram Tam, MSc – Applied Materials
Session Moderator: Michael Corbett, MBA – Linx Consulting