FHE Processing & Integration III

Session Chair(s)

• 

  Eric Forsythe, PhD

  Program Manager Hybrid Electronics
  DEVCOM Army Research Laboratory, MD, United States

Presentations:

• 10:20am – 10:40am

  Impulse Printing™—enabling 3D Printed Interconnects for Volume Production
  

  Speaker: Rob Hendriks – TNO Holst Centre
• 10:40am – 11:00am

  Copper Hybrid Printing Solution for Flexible Electronic Manufacturing
  
  

  Speaker: Christophe Sansregret, Eng – MiQro Innovation Collaborative Center (C2Mi)
• 11:00am – 11:20am

  Direct Printing of Molten Solder via Starjet Technology in Flexible Hybrid Electronics
  

  Speaker: Zeba Khan, MSc – IMTEK, Albert Ludwig's University of Freiburg
• 11:20am – 11:40am

  A Semiconductor Foundry in a Box—scalable Manufacturing of Nano and Microelectronics Using Directed Assembly of Nanomaterials
  

  Speaker: Ahmed Abdelaziz, PhD – Northeastern University
• 11:40am – 12:00pm

  Organic Thin-film Transistor Gas Sensor Circuit Level Humidity Effect Suppression
  

  Speaker: Wudyalew Wondmagegn, PhD – The College of New Jersey