Technical Fellow
Boeing Research and Technology, AL, United States
John D. Williams received his PhD in Engineering Science from LSU in 2004 and became a NextFlex Fellow in 2019 and a Boeing Technical Fellow in 2022. John has 17 years of Principal Investigator experience in device fabrication and is currently the principal investigator on numerous NextFlex contracts focused on antenna arrays and multilayer printing on curved surfaces. John is currently developing Additive Electronics Technologies (AET) for use on Boeing platforms. From 2004 to 2014 he served as a Senior Member of the Technical Staff at Sandia National Laboratories, and as an Assistant Professor of Electrical, Optical and Material Engineering at the University of Alabama in Huntsville (UAH). He joined Boeing in 2014 to found the Boeing Research and Technology AET effort in Huntsville where his team performs novel research in microwave filters, antennas, and flexible hybrid electronic (FHE) sensors by maturing manufacturing capabilities, implementing modeling and simulation, and developing prototype demonstrators.
John is the principal / co-principal investigator for 4 concurrent NextFlex MII Projects. He has led, or co-led, 7 other NextFlex projects, serves on the NextFlex Technical Council, and is an industry co-lead for the NextFlex Materials Technical Working Group. He also serves as an industrial committee member for the ManTech JDMTP Electronics Subpanel. In 2021 he served on the organizing committee for the IEEE International Flexible Electronics Technologies Conference (IFETC). John has published more than 30 peer reviewed articles, over 30 US patents, 17 international patents, 4 Boeing trade secrets, and dozens of pending patents. John’s Boeing related inventions on microwave filters, conformal antennas, hyperspectral metrology, and cryogenic cooling of MW class EMI filters are currently being developed for multiple program efforts.
Disclosure information not submitted.
Tuesday, July 12, 2022
9:15am – 9:45am