Chair
Heterogeneous Integration Roadmap, IEEE EPS
William Chen (Bill) holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining the ASE, he was the Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. He was a past President of the IEEE Electronics Packaging Society. He has been elected a Fellow of IEEE and a Fellow of ASME. He received the IEEE Electronics Packaging Field Award for contribution to electronic packaging from research & development through industrialization. He chairs the Heterogeneous Integration Roadmap initiative.
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Wednesday, July 13, 2022
2:00pm – 4:45pm
Wednesday, July 13, 2022
2:00pm – 2:10pm
Wednesday, July 13, 2022
4:35pm – 4:45pm