Principal Engineer GlobalFoundries, NY, United States
As node sizes have decreased and wafer sizes have increased, subtools have played an amplified role in semiconductor manufacturing. While process chambers and fab tools have adopted standardized communication standards and polling requirements, subtools have continued without industry alignment. With the ability to fully stream parameter data to the process tool and to contextualize the information, it becomes possible to realize energy conservation, line yield improvement, and maintenance optimization. To accomplish this, the industry must align on a communication standard for all ancillary equipment to interface with the main tool.
