Professor University at Buffalo, The State University of New York
Each year, more than 60% of Cu is used in electrical applications due to its excellent electronic, thermal and mechanical properties. Here, we report the printable Cu ink material development for flexible conformal electronics, particularly high temperature electronics applications. Our findings show that Cu conductors printed onto flexible ceramics offer an opportunity to develop conformal high-temperature electronics with hybrid eco-friendly printability, providing new routes for manufacturing large-scale flexible hybrid electronics. In addition, flexible dielectric material with high thermal conductivity will also be discussed.
