Ecosystem Readiness for Scaling and Lithography at 3nm and Below

Thursday, July 14, 2022

10:30am – 3:30pm

Location: TechTALKS Stage, South Hall, Lower Lobby

Session Moderator(s)

Debra Vogler, MS

President
Instant Insight, CA, United States

Speaker(s)

Nelson Felix, PhD

Director, Process Technology
IBM
Michael Lercel, PhD

Senior Director Strategic Marketing
ASML, Connecticut, United States
David Fried, PhD

Vice President ,Computational Products
Lam Research, California, United States
Maud Vinet, PhD

Quantum hardware program manager
CEA Leti, France
Sarah Okada

Director of Product Marketing
Nova Measuring Instruments, CA, United States
Steven Scheer, PhD in Chemical Engineering

Senior Vice President Advanced Patterning, Process and Materials
imec
Julie Bannister

Sr. Manager Strategic Marketing
TEL, TX, United States
Ray Simmonds, PhD

Physicist
National Institute of Standards & Technology, CO, United States
Chris Progler, PhD

Executive Vice President, CTO and Strategy
Photronics, TX, United States
Thomas Uhrmann, PhD

Business Development DIrector
EV Group, Austria

Meeting the demands for quantum computing, artificial intelligence, autonomous driving, and other high-performance applications, continues to drive device scaling—whether by traditional means, or nontraditional (3D ICs, heterogeneous integration, etc.). Furthermore, with ever higher-NA EUVL tools in development, the industry ecosystem must also be prepared with resist, mask, and metrology solutions. Likewise, the demand for quantum computing technologies is driving selection of new materials and novel device architectures. The morning and afternoon sessions will cover these topics.

Presentations:

10:30am – 10:35am

Welcome Remarks: Ecosystem Readiness for Scaling and Lithography at 3nm and Below
Session Moderator: Debra Vogler, MS – Instant Insight
10:35am – 10:55am

The Path to 100 Billion Goes Upward – IBM Research Semiconductors Technology Atlas
Speaker: Nelson Felix, PhD – IBM
10:55am – 11:15am

Holistic Patterning to Enable Manufacturing for 3nm and Beyond
Speaker: Michael Lercel, PhD – ASML
11:15am – 11:35am

Beyond EUV: DTCO and Material Optimization for 3nm and Beyond
Speaker: David M. Fried, PhD – Lam Research
11:35am – 11:55am

Silicon Based Quantum Computing as a Disruptive Paradigm for Computing?
Speaker: Maud Vinet, PhD – CEA Leti
11:55am – 12:15pm

Gate-all-around Presents New Metrology Challenges and Opportunities
Speaker: Sarah Okada – Nova Measuring Instruments
12:15pm – 12:30pm

Q&A and Closing Remarks
Session Moderator: Debra Vogler, MS – Instant Insight
1:30pm – 1:35pm

Welcome Remarks: Ecosystem Readiness for Scaling and Lithography at 3nm and Below
Session Moderator: Debra Vogler, MS – Instant Insight
1:35pm – 1:55pm

High NA Ecosystem Readiness for Scaling and Lithography at 3nm and Below
Speaker: Steven Scheer, PhD in Chemical Engineering – imec
1:55pm – 2:15pm

Outlook for high NA EUV Patterning: A holistic patterning approach to address upcoming challenges
Speaker: Julie Bannister – TEL
2:15pm – 2:35pm

Layer Transfer and Bonding Technologies Enabling Next Generation Scaled Devices
Speaker: Thomas Uhrmann, PhD – EV Group
2:35pm – 2:55pm

Challenges & Opportunities for Developing Superconducting Quantum Information Systems
Speaker: Ray Simmonds, PhD – National Institute of Standards & Technology
2:55pm – 3:15pm

Photomask Challenges and Opportunities on the Road to 3nm
Speaker: Chris Progler, PhD – Photronics