How Are You Shaping a More Resilient Supply Chain – Perspectives and Possibilities

Tuesday, July 12, 2022

11:20am – 12:20pm

Location: Keynote Stage, North Hall, Room 24

Panel Session Moderator(s)

Bettina Weiss

Chief of Staff & Corporate Strategy
SEMI, CA, United States

Panelist(s)

Richard Barnett

Chief Marketing Officer
Supplyframe, California, United States
Boris Finselberg, MA

Vice President, Global Sector Technology
DHL Customer Solutions & Innovation, FL, United States
Douglas Lefever, BSE, MSE, MBA

President and CEO
Advantest, CA, United States
Carolin Seward

Vice President, Sourcing Operations for Silicon
Google, California, United States
Bruce J. Tufts, PhD

Vice President, Global Sourcing Equipment Materials, Director Fab Materials Organization
Intel

Semiconductor chips have become ubiquitous in recent years, and all aspects of society have become extremely dependent on semiconductors. Demand has shifted from traditional applications for PCs and mobile phones to automobiles and other connected applications, fueled by 5G and IoT. Post Covid revenue growth for semiconductors has been unprecedented (20+% growth) but has been severely challenged as new disruptive factors have emerged and have accelerated in magnitude and frequency:

• Increasing geo-political risks requiring integrated and aligned global policies that often remain elusive and uncoordinated
• Escalating unplanned events such as natural disasters and pandemics - “Black Swan” events and the “New Normal”
• Heightened global focus on sustainability, safety, and security

These factors have highlighted the inherent vulnerabilities and interdependencies of multi-tier supplier relationships in the electronics and adjacent value chains. Time to decide and act determines survival.

This panel will discuss how supply chain models need to fundamentally change to meet the needs of the global electronics manufacturing industry in the next 5 years and beyond.