Program Lead TNO Holst Centre, Noord-Brabant, Netherlands
Impulse Printing™ is a brand new technology developed by Holst Centre that will bring unique 3D interconnect solutions to the back-end semiconductor and display market. High resolution structures can be printed over steps, gaps, and even wrapped around substrates at incredible speeds. For example, wrap-around printing of electrodes to create a back-to-front interconnect for µLED displays, or printing directly on silicon dies as an alternative to wire bonding. Off the shelf materials such solder paste, conductive adhesive, silver micron flake ink, copper nanoparticle ink and dielectric ink have already been printed successfully, showing compatibility with a wide range of viscosities and particles sizes. The unique capability of printing almost any materials onto any type of topology makes Impulse Printing™ suitable for quick adoption into existing production lines.
