Robert M. Scharff 1977 Professor Cornell University, NY, United States
Printed Electronics for fabrication of flexible sensors requires integration of multiple materials. These include conductors, insulators, and sensor materials. Printed Electronics using inkjet printing has the potential for enabling multiple materials to be printed sequentially. For example, a Wheatstone bridge strain gauge can be formed from resistive and conductive inks. However, there are several challenges that prevent sensor integration, the foremost is the predictable material properties of the ink, and the dimensional control of the structures. Matching between devices is not achieved easily due to process variations. We are using novel metrology tools including ultrasonic imaging to characterize ink properties and using dimensional measurements to develop an AI-ML model to design high performance sensors.
Peter Doerschuk (Cornell), Landon Ivy (Cornell), June Ho Hwang (Cornell), Ben Davaji (Northeastern), Ved Gund (Cornell), Carlos Ospina (Botfactory), Anuj Baskota (Geegah), Justin Kuo (Geegah)
