R&D Manager of Alloy Group
Indium Corporation
Clinton, New York, United States
Biography
Dr. Hongwen Zhang is the Research & Development Department manager of the Alloy Group in Indium Corporation. His focus is on the development of lead-free solder materials and associated technologies for drop-shock-resistance low-temperature, high-temperature lead-free and high-reliability applications. He and Dr. Ning-Cheng Lee invented the Durafuse solder paste technique to improve wetting, reduce processing temperatures, modify the bonding interface, control the joint’s morphology, and improving the reliability. On the basis of this technique, the DurafuseTM LT, BiAgX® and DurafuseTM HT solder system were invented and commercialized.
Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials science and engineering from the Institute of Metal Research, Chinese Academy of Science, a master’s degree in mechanical engineering, and a Ph.D. in materials science and engineering from Michigan Technological University. Dr. Zhang co-authored two book chapters on high-temperature lead-free bonding materials. He and his colleagues have had seven patents granted globally and have filed numerous other patents on electronics interconnection materials. He has published approximately 40 journal and conference publications in the field of materials, physics, mechanics.
Dr. Zhang has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is a certified IPC Specialist for IPC-A-600 and IPC-A-610D and a certified SMT Process Engineer. Dr. Hongwen Zhang is the chair of ASM Mohawk Valley Chapter and actively involved in numerous consortium projects from iNEMI, AEC, DA5 and HDPUG etc.
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