Research Scientist Dow Toray Co., Ltd. Ichihara, Japan
Silicone material is famous for its optical transparency and photothermal stability, for which it is often used in display assembly applications such as optical bonding or encapsulation. However, silicone material carries a limitation of CTE (Coefficient of Thermal Expansion) mismatching with most substrates, resulting in high thermal stress in the laminated body. In this presentation, a novel silicone hotmelt solution for these applications will be introduced. A newly developed silicone hotmelt adhesive provides excellent stress relaxation, mechanical toughness and adhesion capabilities for harsh reliability conditions; it also allows for unique methods of applying onto the substrate.
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