Research Scientist CTCK (Corning Technology Center Korea) Asan, Republic of Korea
MiniLED backlight can enable better picture quality and slimmer form factor of LCD. However, incumbent organic substrate for miniLED circuit board does not meet the new requirements of miniLED backlight as the number of dimming zones increases and LED size becomes smaller. GCB allows for higher dimensional stability and lower warpage as opposed to organic substrates. This in turn can not only improve LED transfer yield and reliability but also provide more design options to display makers for smaller LED sizes, larger board sizes, and more efficient thermal management. For large-size monolithic GCB bigger than conventional PCB substrate sizes, Corning Inc. developed thick (> 4um) Cu metallization capability on glass substrate with low warpage ( < 150um) at Gen5 scale. With the Gen5 metallized glass substrates (Corning EAGLE XG®), we also demonstrated 32” GCB with multi-layer circuit patterns.
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